2022 Call For Papers

2022 CMC Conference Call For Papers is Now Closed

Thank you to all those who submitted an abstract for this year's Conference. If you are interested in submitting an abstract for our next event, please email us by clicking here to get on our mailing list, or check back with us in July when we will be accepting abstracts for our Fall CMC Seminar!


TECHCET announces a call for papers for the upcoming 2022 CMC conference – “Mission Critical Materials Keeping Pace with Chip Supply & Demand”. The Conference will focus on challenges of materials and manufacturing of semiconductor devices – those materials issues most critical for today and those needed to be solved for the future.

TECHCET is looking to find the best original work from all areas of the semiconductor industry pertinent to materials. To submit a paper for consideration, please send a 1-page abstract focusing on critical materials supply dynamics to Jonas Sundqvist at [email protected]. The call for papers deadline is January 15, 2022.

The conference is currently being planned to be in person in Phoenix, Arizona from April 28-29, 2022, however, it is subject to change based on COVID-19 guidelines and may become virtual if the situation arises.

The Critical Materials Council (CMC) Conference is a 2-day event providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Unlike other conferences, the CMC Conference provides practical information addressing "How-to" not just "What." Solutions to process challenges and materials-related issues are a key focus for the CMC conference presenters. Equally important focal points include business and supply-chain trends and materials needed for emerging technologies.

2022 CMC Conference welcomes submissions to cater to our 5 Sessions:

  1. Global Issues & Trends Impacting Materials
  2. Immediate Challenges of Materials and Manufacturing
  3. Equipment & Consumable Component Materials
  4. Emerging Materials in R&D and Pilot Fabrication
  5. Heterogenous Integration& Advanced Packaging Materials

Material areas of consideration include front end and back end process materials and equipment components, including: wafers & substrates, electronic gases, chemicals, CMP consumables, sputter targets, precursors, metal chemicals, photoresist and other lithography materials; packaging materials; and equipment components, with emphasis on quartz, SiC, and ceramics.