TECHCET announces a call for papers for the upcoming
2023 CMC conference.
TECHCET is looking to find the best original work from all areas of the semiconductor industry pertinent to materials. To submit a paper for consideration, please send a 1-page abstract focusing on critical materials supply dynamics to Jonas Sundqvist at [email protected]. The call for papers deadline is January 20, 2023. Please specify if you are interested in providing a paper or presentation or both.
The conference is currently being planned to be in person at the Embassy Suites, in Round Rock (Austin area), Texas from April 18-20, 2023.
The Critical Materials Council (CMC) Conference is a 2-day event, with welcome reception on the 18th, providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Unlike other conferences, the CMC Conference provides practical information addressing "How-to" not just "What." Solutions to process challenges and materials-related issues are a key focus for the CMC conference presenters. Equally important focal points include business and supply-chain trends and materials needed for emerging technologies.
2023 CMC Conference welcomes submissions to cater to our 5 Sessions + Poster Session:
1. Global Issues & Trends Impacting Materials
2. Heterogenous Integration& Advanced Packaging Materials
3. Immediate Challenges of Materials and Manufacturing
4. Equipment & Consumable Component Materials
5. Emerging Materials in R&D and Pilot Fabrication
+ Poster Session!
Material areas of consideration include front end and back end process materials and equipment components, including: wafers & substrates, electronic gases, chemicals, CMP consumables, sputter targets, precursors, metal chemicals, photoresist and other lithography materials; packaging materials; and equipment components, with emphasis on quartz, SiC, and ceramics.
The 2023 CMC Conference Committee is also welcoming student submissions for our Poster Session! Submissions may involve materials processes, and/or semiconductor manufacturing challenges as they relate to materials or materials technology. Material areas may include:
1. Metals - metal chemicals, sputter targets, precursors, packaging metals, etc.
2. Wet chemicals / specialty cleans
3. Dielectric precursors
4. Gases (bulk or specialty)
5. Equipment & Consumable Component Materials
6. Emerging Materials in R&D
7. Wafers & substrates
8. Heterogenous Integration& Advanced Packaging Materials
TECHCET will also be awarding the Best Poster by a Student from US University $1000*
* Author must be available at the conference to win.