2023 Speaker Bios

   Bio coming soon.

Jean-Christophe Eloy is Yole Group’s President and CEO. Created in 1998, the market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, teardown, reverse engineering and reverse costing analysis in addition to corporate finance services. His mission is to oversee the strategic direction of Yole Group of companies, including Yole Intelligence, Yole SystemPlus and PISÉO.

All year long, Jean-Christophe builds deep relationships with leading semiconductor companies, discussing and sharing information across his global network. His aim is to get a comprehensive understanding of their strengths and guide their success.

Jean-Christophe is a graduate from EMLyon Business School (Lyon, France) and from INPG (Grenoble, France).

Taylor St. Germain is a Microelectronics Forecasting Analyst at TechInsights and is a member of the TechInsights Market Analysis Leadership Team. He received his undergraduate degree in Statistics and Mathematics from the University of Vermont. Prior to TechInsights, Taylor was an economic analyst and business consultant. Taylor worked with Fortune 500 companies, trade associations, and small business to provide economic intelligence to drive strategic and profitable business decisions. Throughout this time, Taylor was also a keynote speaker that traveled the US delivering custom presentations to organizations to help them better navigate the economic cycle now and in the future.

Regina Freed is VP of AIx Solutions, Applied Materials. She has more than 20 years of experience in the semiconductor industry, managing semiconductor process and equipment development teams for both logic and memory processes, including co-optimization between deposition and etch, lithography, metrology, and defect inspection. At Applied Materials, Regina leads the AIx program that enables Applied Materials and our customers to accelerate development and ramp through Actionable Insights as well as control our processes to deliver improved process windows, enabling customers to scale faster and at lower cost, while optimizing device performance.

 

Lita Shon-Roy – President/CEO and Founder of TECHCET—has worked throughout the semiconductor supply chain, leading strategy, business development, marketing and sales for chip designers, equipment OEMs, and material suppliers for over 30 years.

Her experience spans from process development of memory chips to business development of gases & precursors. She developed new business opportunities for companies such as RASIRC/Matheson Gases, Air Products & Chemicals, and IPEC/Speedfam, and managed marketing and sales in companies such as Air Products/Schumacher, Brooktree/Rockwell, and Hughes Aircraft.

Ms. Shon-Roy is considered one of the leading experts in electronic materials market analysis and business development. She has authored and co-authored 100’s of articles, reports and texts on semiconductor process materials markets, trends, and worldwide supply chain issues, and has been quoted in the Wall Street Journal and featured on BBC News. She holds an M.B.A. from California State University, Dominguez Hills, a M.S.E.E. focused on Solid State Physics from the University of Southern California, and a B.S. in Chemical Engineering from UC San Diego.

Dan P. Tracy, Ph.D. is TECHCET’s Sr. Director of Market Research, expert in materials market analysis with a focus on sputtering targets, deposition and packaging materials. He has over 30 years of market analysis experience covering semiconductor packaging, thin films, semiconductor process equipment, and semiconductor materials. He has particular expertise in analyzing dependencies between equipment and materials, and between the front- and back-end of the semiconductor industry, including insights pertaining to LEDs, MEMS, and sensors. Prior to TECHCET he led the Industry Research & Statistics group at SEMI as Sr. Director and worked for Rose Associates covering electronic materials as a Sr. Analyst. Additionally, Dan has a background in packaging engineering from National Semiconductor He holds a Ph.D. in Materials Engineering from Rensselaer Polytechnic Institute, a M.S. in Materials Science & Engineering from Rochester Institute of Technology, and a B.S. in Chemistry from SUNY College of Environmental Science and Forestry.