The 5th Annual CMC Conference

“Critical Materials Pushing the Limits for Semiconductor Manufacturing”

Scheduled for October 21-22, the 5th CMC Conference, will explore actionable technical and value-chain trends of critical materials for global semiconductor fabs and feature keynotes from leaders in semiconductor technology and materials. This year we will hosting a “live event” digitally engaging, especially configured to deliver you the best virtual networking experience. Don’t forget to check out our new addition to the 2020 CMC Conference: Heterogeneous / Advanced Packaging Materials.

Four Impactful Sessions will cover: 
      I. Global Issues & Trends Impacting Materials,
      II. Immediate Challenges of Materials & Manufacturing, 
      III. Emerging Materials in R&D and Pilot Fabrication, and 
      New this year, 
      IV. Heterogeneous Integration and  Advanced Packaging Materials

Please note, the times are in Pacific Daylight Time (PDT)

PDT	CMC Conference Agenda (Updated Weekly)
8:00	Opening Remarks Conference Chairs: Karey Holland, PhD and Jonas Sundqvist, PhD
8:10	Keynote by Bruce Tufts, Vice President of Technology and Director of Fab Materials Organization, Intel Corp. on “Critical Materials Pushing the Limits for Semiconductor Manufacturing”
Day 1, I. Global Issues & Trends Impacting Materials
8:55	Session I Chairs: Alan Balderson, Kanto & Jeff Hemphill, Intel	Overview of Session Presentations
	Speaker	Topic
9:05	G. Dan Hutcheson, CEO, and Risto Puhakka, President, VLSI Research	De-Globalization
9:30	Lita Shon Roy, President/CEO, TECHCET	Materials Markets on the other side of the Pandemic
10:00	*Coffee Break – with Edwards*
10:15	Nedal T. Nassar, PhD, Chief, Materials Flow Analysis, National Minerals Info Center, USGS	Critical Mineral Commodity Supply Risk for the United States
10:45	Prof. Mike Czerniak, Edwards Corporation Product Marketing & University of Bristol Professor	Green Chips
11:15	Silke Sorger, VP & Head of Global Procurement Direct Material, Facility Management and Energy, Infineon	Challenges to the Survival of Regional Supply Chains
11:45	Adam Schafer, PhD, Director Supply Chain Sustainability, Intel	Intel’s Supply Chain Sustainability Programs for Manufacturing
12:15	*Umicore – the Business of Metals*	*Sponsored feature with Lunch Offer*
12:25	*Lunch Break*
II. Immediate Challenges of Materials & Manufacturing
1:30	Session II Chairs: Mark Raynor, PhD, Matheson and Joel A. Strupp, P.E., TI	Overview of Session Presentations
1:40	Scott Jones, Managing Partner, KPMG	Is the World “On sale”? M&A Activity
2:10	Steve Eckhardt, Vice President, Global Helium, Matheson	Helium Market Update
2:40	Laura Matz PhD, VP of Planarization, MERCK EMD/Versum	The Future of Quality in Formulated Products
3:10	Phil Hecker, WPL Supplier Quality Director , Texas Instruments	Supplier Quality: Challenges in Semiconductor Supply Chain Management
3:40	*Coffee Break – with Top Metal*
3:55	Shaun Miller, Director, FE Global Materials Procurement, Micron Technology	Materials Challenges for Leading Edge Memory Manufacturing
4:25	Jose Arno PhD, CTO, NuMat Technologies	MOF-Enabled Safety and Productivity Advances for Dopant and Precursor Gas Delivery
4:55	Ashwini Sinha PhD, Director, Linde	Ion Implantation Materials Evolution & Dopant Sources Driven Productivity Enhancement
5:00	Instructions on NSU
5:25	*The Not-So-Usual Round Table Session = Trivia + GrubHub-Beer + Networking*

Day 2, III. Emerging Materials in R&D and Pilot Production
9:00	Session 3 & 4 Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET
9:20	Satyavolu Papa Rao PhD, VP for Research, NY Creates / SUNY Polytechnic Institute	Materials Requirements for Quantum Technologies
9:50	Ian Brown PhD, VP of Engineering, SCREEN	Wet Etching and Cleaning in the 3D Era
10:20	*Coffee with SACHEM*
10:35	*Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide – Introductions / Overview*
10:40	John Petersen, PhD, Principal Scientist, AttoLab & Adv. Patterning, imec	Ultrafast Research in Attosecond Laboratory: Bridging Technology Gap in EUV Resist and Device materials – Today To The Quantum Age
11:10	Pamela Fischer PhD, Technologist and New Product Introduction Manager, ASM	Materials Evolution & Challenges In ALD/EPI FEOL
11:40	Kandabara Tapily, PhD, Member of Technical Staff, TEL	Selective Deposition for Advanced Patterning
12:10	*Lunch Break*
13:10	Milind Weling, SVP and Head of Programs and Operations, EMD Performance Materials	Selectors for Emerging Memories: How Are They “Materially” Different?
13:40	Wenke Weinreich PhD, Head of Business Unit IOT Components & Systems, Fraunhofer IPMS-CNT	HfO2 Ferroelectrics for NVM and Piezo- and Pyro-sensing Applications
14:10	Jodi Stolove, CDF	Stretching The Limits
14:25	Ashutosh Misra, PhD, Chief Technology Officer, Electronics at Air Liquide	New Etching Gases for Advanced Memory Manufacturing
14:55	Akihiro Nishida, Semiconductor Materials Lab Manager, ADEKA	ALD Precursor Developments for Mass Production of Future Semiconductor Devices
15:25	Terry Francis & Jonas Sundqvist PhD, Sr. Technical Analysts, TECHCET	ALD/CVD Precursor Applications & Market Trends
15:55	*Wrap Up/Depart*

10:40Lauren Link PhD, Manager, Substrate Business Group, Intel CorporationMaterials for Heterogeneous Integration: Supply-Chain Challenges

Day 2, IV. Heterogeneous Integration & Advanced Packaging Materials
9:00	Session 3 & 4 Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET
9:20	Satyavolu Papa Rao PhD, VP for Research, NY Creates / SUNY Polytechnic Institute	Materials Requirements for Quantum Technologies
9:50	Ian Brown PhD, VP of Engineering, SCREEN	Wet Etching and Cleaning in the 3D Era
10:20	*Coffee Break*
10:35	*Session Chairs: Jim Hannah, SEH and Dan Tracy, TECHCET – Introductions / Overview*