2020 CMC Conference Agenda

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The 5th Annual CMC Conference

"Critical Materials Pushing the Limits for Semiconductor Manufacturing"

Scheduled for October 21-22, the 5th CMC Conference, will explore actionable technical and value-chain trends of critical materials for global semiconductor fabs and feature keynotes from leaders in semiconductor technology and materials. This year we will hosting a "live event" digitally engaging, especially configured to deliver you the best virtual networking experience. Don't forget to check out our new addition to the 2020 CMC Conference: Heterogeneous / Advanced Packaging Materials.

Four Impactful Sessions will cover: 
      I. Global Issues & Trends Impacting Materials,
      II. Immediate Challenges of Materials & Manufacturing, 
      III. Emerging Materials in R&D and Pilot Fabrication, and 
      New this year, 
      IV. Heterogeneous Integration and  Advanced Packaging Materials 
PDT CMC Conference Agenda (Updated Weekly)
Day 1
  Opening Remarks Conference Chairs: Karey Holland, PhD and Jonas Sundqvist, PhD
  Keynote by Bruce Tufts, Vice President of Technology and Director of Fab Materials Organization, Intel Corp. on "Critical Materials Pushing the Limits for Semiconductor Manufacturing"
I. Global Issues & Trends Impacting Materials
Session Chairs: Alan Balderson, Kanto, and Jeff Hemphill, Intel
  Speaker Topic
  Session I Chairs: Alan Balderson, Kanto & Jeff Hemphill, Intel Overview of Session Presentations
  G. Dan Hutcheson, CEO, and Risto Puhakka, President, VLSI Research De-Globalization
  Lita Shon Roy, President/CEO, TECHCET Materials Markets on the other side of the Pandemic
  Coffee Break - with Edwards
  Nedal T. Nassar, PhD, Chief, Materials Flow Analysis, National Minerals Info Center, USGS Critical Mineral Commodity Supply Risk for the United States
  Prof. Mike Czerniak, Edwards Corporation Product Marketing & University of Bristol Professor Green Chips
  Silke Sorger, VP & Head of Global Procurement Direct Material, Facility Management and Energy, Infineon Challenges to the Survival of Regional Supply Chains
  Adam Schafer, PhD, Director Supply Chain Sustainability, Intel Intel's Supply Chain Sustainability Programs for Manufacturing
  Umicore - the Business of Metals Sponsored feature with Lunch Offer
  Lunch Break
II. Immediate Challenges of Materials & Manufacturing
Session Chairs: Mark Raynor, PhD, Matheson and Joel A. Strupp, P.E., TI
  Session II Chairs: Mark Raynor, PhD, Matheson and Joel A. Strupp, P.E., TI Overview of Session Presentations
  Scott Jones, Managing Partner, KPMG Is the World "On sale"? M&A Activity
  Steve Eckhardt, Vice President, Global Helium, Matheson Helium Market Update
  Laura Matz PhD, VP of Planarization, MERCK EMD/Versum The Future of Quality in Formulated Products
  Phil Hecker, WPL Supplier Quality Director , Texas Instruments Supplier Quality: Challenges in Semiconductor Supply Chain Management
  Coffee Break - with Top Metal
  Shaun Miller, Director, FE Global Materials Procurement, Micron Technology Materials Challenges for Leading Edge Memory Manufacturing
  Jose Arno PhD, CTO, NuMat Technologies MOF-Enabled Safety and Productivity Advances for Dopant and Precursor Gas Delivery
  Ashwini Sinha PhD, Director, Linde Ion Implantation Materials Evolution & Dopant Sources Driven Productivity Enhancement
  Instructions on NSU  
  The Not-So-Usual Round Table Session = Trivia + GrubHub-Beer + Networking
Day 2
III. Emerging Materials in R&D and Pilot Production
Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET
  Session 3 Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET Overview of Session Presentations
  Satyavolu Papa Rao PhD, VP for Research, NY Creates / SUNY Polytechnic Institute Materials Requirements for Quantum Technologies
  Mark Neisser, TECHCET Litho Materials Market Forecast & Update
  Dr. Pamela Fischer, Technologist and New Product Introduction (NPI) Manager, ASMI ALD/Epi FEOL
  Ashutosh Misra, Chief Technology Officer, Electronics at Air Liquide New gases for Atomic Layer Etching
  Kandabara Tapily, PhD Tokyo Electron  Selective Deposition for Advanced Patterning
  Coffee Break  
  Akihiro Nishida, Semiconductor Materials Lab Manager, ADEKA ALD Precursor Developments for Mass Production of Future Semiconductor Devices
  Wenke Weinreich PhD, Head of Business Unit IOT Components & Systems, Fraunhofer IPMS-CNT HfO2 Ferroelectrics for NVM and Piezo- and Pyro-sensing Applications
  Terry Francis & Jonas Sundqvist PhD, Sr. Technical Analysts, TECHCET ALD/CVD Precursor Applications & Market Trends
IV. Heterogeneous Integration & Advanced Packaging Materials
Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET
  Session 3 & 4 Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET
  Keynote, Dr. Subramanian Iyer, Professor UCLA and founder CHIPS Consortium The Future of Silicon as a Packaging Material
  Lauren Link, PhD. Manager, Substrate Business Group, Intel Materials for Heterogeneous Integration: Supply Chain Challenges
  Dr. Alejo Lifschitz, Senior Scientist , DuPont Challenges and opportunities in shrinking RDL features; microstructure control of Cu deposits for improved fill and reliability
  Coffee Break  
  Dr. Lihong Cao, Director, Engineering and Technical Marketing, ASE Advanced Packaging Solutions and Material Challenges for Heterogenous Integration
  Dr. Dan Tracy, TECHCET Advanced Packaging Materials Market Overview
  Dr. Minfeng Yu, Professor, School of Aerospace Engineering, Georgia Inst. of Tech. 3D Cu Microprinting Using Meniscus-Confined Electrodeposition