The 5th Annual CMC Conference
"Critical Materials Pushing the Limits for Semiconductor Manufacturing"
Scheduled for October 21-22, the 5th CMC Conference, will explore actionable technical and value-chain trends of critical materials for global semiconductor fabs and feature keynotes from leaders in semiconductor technology and materials. This year we will hosting a "live event" digitally engaging, especially configured to deliver you the best virtual networking experience. Don't forget to check out our new addition to the 2020 CMC Conference: Heterogeneous / Advanced Packaging Materials.
Four Impactful Sessions will cover: I. Global Issues & Trends Impacting Materials, II. Immediate Challenges of Materials & Manufacturing, III. Emerging Materials in R&D and Pilot Fabrication, and New this year, IV. Heterogeneous Integration and Advanced Packaging Materials
PDT | CMC Conference Agenda (Updated Weekly) | |
Day 1 | ||
Opening Remarks Conference Chairs: Karey Holland, PhD and Jonas Sundqvist, PhD | ||
Keynote by Bruce Tufts, Vice President of Technology and Director of Fab Materials Organization, Intel Corp. on "Critical Materials Pushing the Limits for Semiconductor Manufacturing" | ||
I. Global Issues & Trends Impacting Materials Session Chairs: Alan Balderson, Kanto, and Jeff Hemphill, Intel |
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Speaker | Topic | |
Session I Chairs: Alan Balderson, Kanto & Jeff Hemphill, Intel | Overview of Session Presentations | |
G. Dan Hutcheson, CEO, and Risto Puhakka, President, VLSI Research | De-Globalization | |
Lita Shon Roy, President/CEO, TECHCET | Materials Markets on the other side of the Pandemic | |
Coffee Break - with Edwards | ||
Nedal T. Nassar, PhD, Chief, Materials Flow Analysis, National Minerals Info Center, USGS | Critical Mineral Commodity Supply Risk for the United States | |
Prof. Mike Czerniak, Edwards Corporation Product Marketing & University of Bristol Professor | Green Chips | |
Silke Sorger, VP & Head of Global Procurement Direct Material, Facility Management and Energy, Infineon | Challenges to the Survival of Regional Supply Chains | |
Adam Schafer, PhD, Director Supply Chain Sustainability, Intel | Intel's Supply Chain Sustainability Programs for Manufacturing | |
Umicore - the Business of Metals | Sponsored feature with Lunch Offer | |
Lunch Break | ||
II. Immediate Challenges of Materials & Manufacturing Session Chairs: Mark Raynor, PhD, Matheson and Joel A. Strupp, P.E., TI |
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Session II Chairs: Mark Raynor, PhD, Matheson and Joel A. Strupp, P.E., TI | Overview of Session Presentations | |
Scott Jones, Managing Partner, KPMG | Is the World "On sale"? M&A Activity | |
Steve Eckhardt, Vice President, Global Helium, Matheson | Helium Market Update | |
Laura Matz PhD, VP of Planarization, MERCK EMD/Versum | The Future of Quality in Formulated Products | |
Phil Hecker, WPL Supplier Quality Director , Texas Instruments | Supplier Quality: Challenges in Semiconductor Supply Chain Management | |
Coffee Break - with Top Metal | ||
Shaun Miller, Director, FE Global Materials Procurement, Micron Technology | Materials Challenges for Leading Edge Memory Manufacturing | |
Jose Arno PhD, CTO, NuMat Technologies | MOF-Enabled Safety and Productivity Advances for Dopant and Precursor Gas Delivery | |
Ashwini Sinha PhD, Director, Linde | Ion Implantation Materials Evolution & Dopant Sources Driven Productivity Enhancement | |
Instructions on NSU | ||
The Not-So-Usual Round Table Session = Trivia + GrubHub-Beer + Networking | ||
Day 2 | ||
III. Emerging Materials in R&D and Pilot Production Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET |
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Session 3 Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET | Overview of Session Presentations | |
Satyavolu Papa Rao PhD, VP for Research, NY Creates / SUNY Polytechnic Institute | Materials Requirements for Quantum Technologies | |
Mark Neisser, TECHCET | Litho Materials Market Forecast & Update | |
Dr. Pamela Fischer, Technologist and New Product Introduction (NPI) Manager, ASMI | ALD/Epi FEOL | |
Ashutosh Misra, Chief Technology Officer, Electronics at Air Liquide | New gases for Atomic Layer Etching | |
Kandabara Tapily, PhD Tokyo Electron | Selective Deposition for Advanced Patterning | |
Coffee Break | ||
Akihiro Nishida, Semiconductor Materials Lab Manager, ADEKA | ALD Precursor Developments for Mass Production of Future Semiconductor Devices | |
Wenke Weinreich PhD, Head of Business Unit IOT Components & Systems, Fraunhofer IPMS-CNT | HfO2 Ferroelectrics for NVM and Piezo- and Pyro-sensing Applications | |
Terry Francis & Jonas Sundqvist PhD, Sr. Technical Analysts, TECHCET | ALD/CVD Precursor Applications & Market Trends | |
IV. Heterogeneous Integration & Advanced Packaging Materials Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET |
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Session 3 & 4 Session Chairs: Steve Consiglio, TEL, and Nicholas Blasco, Air Liquide and Jim Hannah, SEH and Dan Tracy, TECHCET | ||
Keynote, Dr. Subramanian Iyer, Professor UCLA and founder CHIPS Consortium | The Future of Silicon as a Packaging Material | |
Lauren Link, PhD. Manager, Substrate Business Group, Intel | Materials for Heterogeneous Integration: Supply Chain Challenges | |
Dr. Alejo Lifschitz, Senior Scientist , DuPont | Challenges and opportunities in shrinking RDL features; microstructure control of Cu deposits for improved fill and reliability | |
Coffee Break | ||
Dr. Lihong Cao, Director, Engineering and Technical Marketing, ASE | Advanced Packaging Solutions and Material Challenges for Heterogenous Integration | |
Dr. Dan Tracy, TECHCET | Advanced Packaging Materials Market Overview | |
Dr. Minfeng Yu, Professor, School of Aerospace Engineering, Georgia Inst. of Tech. | 3D Cu Microprinting Using Meniscus-Confined Electrodeposition |