CMC Application Agenda

Conference Agenda

Registration includes welcome reception at 5:30pm on the 25th, lunch on the 26th, break-out discussions with beer-tasting on the 26th, continental breakfasts and coffee breaks.


Time Presenter Presentation Subject/Title
Keynote:         8:00am KEYNOTE: David Bloss, VP/Director, Intel Patterning Challenges and Fab Materials for Future ICs
Session I: Global Issues
9:00am Scott Jones (Managing Director) KPMG Semiconductor Macro Overview
9:30am Jim Feldham (Partner) Semico Driving Application for the Semiconductor Market; what’s next?
10:15am Lita Shon-Roy, President, TECHCET Critical Materials Market Forecast & Roadmap
10:45am Keith Long (Director) USGS Global Tantalum supply-chain: trends and future challenges
11:15am James Votaw, Partner, Keller & Heckman Regulatory Challenges for Novel Engineered Materials
11:45am Jeff Morris (Director) US EPA TSCA Implementation Update
12:15pm Lunch
Session II. Materials Issues Today
1:30pm Mark Scholefield (Sr. MTS) GLOBALFOUNDRIES Silicon Wafer quality roadmaps
2:00pm Ken Unfried, Sr. Technologist, Linde Neon and Xenon Recycling
2:30pm Terry Francis, Sr. Analyst, TECHCET ALD/CVD/PVD Metal Materials Markets
3:00pm Coffee Break
3:15pm Reg Parker, Strategy & Operations Program Manager, NXP Reverse Supply Chain logistic & IP control
3:45pm Michelle Garza, Sr. R&D Chemist, Fujimi Fast is the only speed: Quick turnaround slurry ramp process
4:15pm Dennis Brestovansky, Director, Praxair Ion Implant Critical Materials
4:45pm Risto Puhakka, President, VLSI Research OEM Markets and Materials Trends
5:15 – 7:30pm Not-So-Usual-Roundtables Break-out Topic Discussions over Craft Beer and Soda
Session III. Near Future Materials
8:00am Sanjeev Aggarwal, VP R&D, Everspin Manufacturing Challenges & Solutions for Toggle-STT-MRAM
8:30am Glen Wilk, VP Corporate R&D, ASM ALD Materials Integration Challenges
9:00am Nick Blasco, Director, Air Liquide Ru precursors, & Co precursors issues
9:30am Lukas Gerlich, Technologist, Fraunhofer Cobalt Integration Solutions (R&D Accelerator)
10:15am Ed Korczynski, Sr. Analyst, TECHCET EUV Materials and Multi-patterning Costs & Modeling
10:45am Alok Ranjan, Director & Sr. MTS, TEL Quasi ALE SiN Technology
11:15am Dave Thompson, Director, Applied Materials Ruthenium Integration
11:45am Lita Shon-Roy, President, TECHCET Concluding Remarks