5th Annual CMC Conference
Keynote:
Bruce Tufts, Vice President of Technology and Director of Fab Materials Organization, Intel Corp.
"Critical Materials Pushing the Limits for Semiconductor Manufacturing"
The CMC and TECHCET announce a new addition to the 2020 CMC Conference:
Heterogeneous Packaging Materials.
Four Impactful Presentation Sessions will cover: I. Global Value-chain Issues, Including Economics and Regulations, II. Immediate Challenges of Materials & Manufacturing, III. Emerging Materials in R&D and Pilot Fabrication, and IV. Heterogeneous / Advanced Packaging Materials - NEW
Lead by Session Chairman Jim Hannah, Product Development and Applications Manager of SEH, the Advanced Packaging Materials Session will address, system level performance scaling issues and the increased reliance on the packaging. As explained by Mr. Hannah, “We see the lines starting to blur between packaging and the back-end wiring on-chip. The CMC Conference will cover both current challenges and future requirements of packaging materials needed to support this middle-ground."
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