Speaker Bios

Adam Schafer is the Director of Supply Chain Sustainability within Intel's Global Supply Chain organization, responsible for Supply Chain ESG and Chemical Compliance. Within this role, Adam oversees Intel’s Supply Line Sustainability, Supplier Code of Conduct, Human Rights/ Labor policies, Chemical Regulations and Policy, Green material selections, Responsible Minerals, and Supplier Diversity & Inclusion programs. Adam joined Intel in 2001 as a process engineer in research and development, then moved to supply chain management in 2005. In 2017, he shifted from yield and metrology equipment to Supply Chain Sustainability. Adam received his B.S. in Chemistry & Philosophy from SUNY Oswego in 1994, and his M.S. & Ph.D. in Physical Chemistry from the University of Washington in 2000. He and his family live in Portland, Oregon.

Originally from Argentina, Dr. Lifschitz obtained his Ph.D. at Northwestern University in inorganic chemistry and held a postdoctoral appointment at the California Institute of Technology. Since 2016, he has been part of the DuPont Electronics & Imaging R&D division (formerly Dow Electronic Materials), where he is focused on new electroless and electrolytic copper product development. His work has centered on material integration with emerging dielectrics, process compatibility with new plating tools, and adaptability to shrinking circuit designs. He participated in the commercialization of 3 new horizontal electroless copper product lines. His current work includes the development of engineered metal deposits for high reliability, broad feature size adaptability, and improved adhesion to smooth dielectrics. He has published 11 peer-reviewed papers, holds 4 granted patents and 2 filed patents.

Akihiro Nishida has Master of Engineering in Chemistry, from Kansai University, Osaka, Japan. Currently working for ADEKA CORPORATION - Japanese Chemicals and Foods Manufacturer and has over 12 years of experience in ALD Precursor & Process Development such as molecule design, synthesis, purification, canister design, chemical analysis, ALD testing, and film characterization.

As the CTO of Air Liquide Electronics, Ashutosh is responsible for defining the global technical vision and product development strategies of the Electronics Business Line. Prior to his current position, he was the Worldwide Director of ALOHA™ Electronics Performance Materials, where he oversaw Air Liquide’s advanced precursor business that supplies leading edge materials for CVD and ALD processes. From 2001-2008, as Director of Materials Development, Ashutosh led the accelerated development and screening of advanced precursors and surface preparation products for semiconductor applications. Ashutosh holds a Ph.D. in Physical Chemistry and was nominated Air Liquide Group Senior Fellow in 2018. He is a co-author of the Handbook of Chemicals and Gases for the Semiconductor Industry , holds 27 US and International patents and has published over 25 research articles in refereed journals.

Dr. Sinha is currently working as Associate Director at Linde’s Electronics R&D. Since joining Linde in 2008, he has developed and commercialized over 15 new products serving electronics and specialty gases market. In his current role he guides the development of novel gas formulations, purification technologies, advanced packaging and delivery systems focused on improving productivity of semiconductor fabrication processes. Prior to joining Linde, he worked in the Thin Films group at Intel’s Logic Technology Development organization. He has authored 14 peer-reviewed publications and holds 18 U.S. patents. He received his Ph.D. in Chemical Engineering from Georgia Institute of Technology.

Bruce J. Tufts is vice president in the Technology and Manufacturing Group and the director of the Fab Materials Organization in Global Supply Chain business unit at Intel Corporation. Bruce is responsible for Intel’s business engagement with the materials supplier ecosystem as well as driving the group’s strategy to enable technology cadence, quality, availability, and affordability for both development and high-volume manufacturing of advanced process technology nodes. Since joining Intel in 1994, Tufts has held various technical and management positions in the thin films area and contributed to the development of dielectric and metals materials, analytic metrology technology, site safety, quality, and Intellectual Property management and Manufacturing/Foundry Services. As of 2019, Bruce has supported the development and transfer to high-volume manufacturing of over ten generations of Intel process technology. Tufts received his bachelor’s degree in chemistry from the University of California, Davis, and completed graduate and post-doctoral work at Stanford University, the California Institute of Technology (Caltech), and the Fritz Haber Institute of the Max Planck Society in Berlin, Germany. He earned his PhD in chemistry from Caltech. He holds several patents in semiconductor processing and has received two Intel Achievement Awards for process implementation of novel thin film materials. Bruce and family live in the country-side west of Hillsboro with their dogs and cats. Bruce’ balances the intensity of Intel-life with a focus on his family; he enjoys time skiing or hiking with his wife and kids, running the mutts, and time on the tractor.

Dan is CEO and Chairman of VLSIresearch inc. He is a recognized authority on the semiconductor industry, winning SEMI’s Sales and Marketing Excellence Award in 2012 for “empowering executives with tremendous strategic and tactical marketing value" through his e-letter, The Chip Insider®; his book Maxims of Hi-Tech, and his many interviews of executives. He is thought of as “the marketing voice and expert for the industry.” “Dan has methodically captured the essence of the industry and produced it in such a way for all to benefit … He has been such an integral part of the industry for so long, it is difficult to imagine the industry without his contributions.” His consulting work has included hundreds of successful programs involving product development, launch, and positioning. Dan has a proven track record of developing economic models that accurately predict trends. He is widely known for the forecasting of strategic infrastructure shifts. This includes his early-eighties development of the first factory cost-of-ownership models, multiple wafer size and lithography transitions, the rise of the fabless/foundry model to counter escalating fab costs, the shift of the DRAM memory market from the United States to Japan in the 1980s, then its shifting again to Korea in 1990s, as well as the driving forces behind the rise of Flash Memory.

Dan’s public work on the industry includes two articles for Scientific American challenging predictions of the demise of Moore’s Law by demonstrating how the innate abilities of scientists to innovate have outpaced the doomsayers, and an invited article on the history and economics of Moore’s Law for the SIA. He has also been the keynote or invited speaker at dozens of conferences. His pro bono work has included serving as an advisor on innovation to the White House Council of Economic Advisors, teaching invited courses at Stanford University, and serving on the Board of Advisors to the Extension School at UC Berkeley. Dan holds two patents and a Master’s degree in Economics from San Jose State University. He is a senior member of the IEEE.

Dan P. Tracy, Ph.D. – Sr. Director of Market Research, TECHCET— covers sputtering targets and deposition materials, and is also in charge of training programs. He has over 20 years of experience in the electronics industry covering supply-chain topics related to semiconductor packaging, thin films, semiconductor process equipment, and semiconductor materials. He analyzes dependencies between equipment and materials, and between the front- and back-end of the semiconductor industry, including insights pertaining to LEDs, MEMS, and sensors. Most recently he was the senior director of the Industry Research & Statistics group at SEMI. Previously he worked for Rose Associates covering electronic materials, and for National Semiconductor as a Packaging Engineer. He holds a Ph.D. in Materials Engineering from Rensselaer Polytechnic Institute, a M.S. in Materials Science & Engineering from Rochester Institute of Technology, and a B.S. in Chemistry from SUNY College of Environmental Science and Forestry.

Ian has 19 years’ semiconductor experience working in a range of roles from research and development, process engineering, application engineering, marketing to field service in Taiwan, Europe and the US. Ian is currently Vice President of Engineering at SCREEN SPE USA and leads a talented team of process and product engineers who engage with customers to advance silicon processing technology for wet cleaning and etching, lithography, annealing, and metrology. Ian holds a Ph.D. in Chemical Engineering from the University of Nottingham and after various assignments in Arizona and Texas is currently based in Portland, Oregon.

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is a columnist with Printed Circuit Design & Fab/Circuits Assembly and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center (WTEC) study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI, IMAPS, and SMTA. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, and the Sidney J. Stein International Award in 2019. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Jodi Stolove,President, CDF (Special Invited Presentation) - A University of Michigan Graduate (BS & MS), Jodi has spent her life’s work in the study of human movement and behavior. She has been featured nationally on the Today Show, CBS This Morning, Barbara Walters’ The View, Howie Mandel, and on news programs around the country. Ms. Stolove is a recognized presenter at leading industry events.

John Petersen is a Principal Scientist and co-leader of the new ultrafast chemistry and physics laboratory at imec, Leuven, Belgium and an adjunct professor of physical chemistry at the University of Maryland, College Park MD. At imec, with the goal to eliminate stochastic print defects, he co-leads with Paul van der Heidethe's effort to study the attosecond to femtosecond ionization and radiolysis processes of EUV resists, studying these processes in the bulk and at the interfacial regions. At UMD, with his collaborators, he is developing three-color molecular switches needed for super-resolution lithography. John is a SPIE Fellow and a former Fellow at SEMATECH. For forty years, John has explored the interaction of the physics of lithographic systems with the chemistry of the imaging materials and their interfaces. John has published 82 papers where he was the primary author of 45 of them, he has been an invited speaker17 times, including one plenary, and holds numerous patents in lithography and super-resolution imaging. In 2006, he won a SEMI Innovation award for the co-development of the supercomputing full Maxwell Equation solver, EMF3,and, in 2018, the University of Adams State bestowed The Outstanding Alumnus Award. Previously, he worked at Texas Instruments, Shipley Company, SEMATECH and, besides imec, John continues consulting with Petersen Advanced Lithography and research with periodic Structures

Jonas Sundqvist, Ph.D. – Sr. Technology Analyst of TECHCET— covers ALD and CVD precursors and related technologies, and is the co-chair of the Critical Materials Council (CMC) Conference. His over 20 years of work experience includes Group Leader of the Thin-Film Technologies Group at The Fraunhofer Institute for Ceramic Technologies and Systems (IKTS) and of the High-k devices group at Fraunhofer's Center Nanoelectronic Technologies (CNT), which included 28nm node work for GLOBALFOUNDRIES Fab1. At Infineon Memory Development Centre (MDC) he developed high-k and metal nitride ALD processes, and at Qimonda he was a materials manager focused on the ALD / CVD precursors supply-chain. He is the founder of BALD Engineering, an independent blog and networking platform for ALD. He holds a Ph.D. and a M.S. in inorganic chemistry from Uppsala University, Sweden, a B.S. in electrical and electronics engineering from Lars Kagg, and nine patents.

Dr. Arno is an accomplished technology and R&D leader with extensive experience in the electronics materials industry. He is currently the Chief Technology Officer at NuMat Technologies in charge of creating the next generation of nano-materials for advanced storage and delivery of electronic gases. Before NuMat, Jose held technology leadership roles at ATMI (now Entegris) and NexPlanar (later acquired by Cabot Microelectronics). Throughout his career, Jose has authored more than 50 technical publications and holds 40 US patents. He received bachelor degrees in both chemistry and physics, and a Ph.D. in physical chemistry from Texas A&M University.

Kanda holds a PhD in electrical and Computer Engineering from Old Dominion University. He is currently a Member of Technical Staff at TEL R&D team located in Upstate NY. His research spans FEOL and BEOL integration and devices including FinFET, nanowire FET, High-k/Metal gate, advanced patterning and atomic layer etch.

Laura Matz is currently a Vice President of Planarization within EMD Performance Materials, located in Tempe, AZ. She has held various commercial positions in Air Products/Versum Materials for the past 7 years with responsibility for both the CMP and the formulated cleans business units. Prior to this, she held various roles in the Air Products R&D organization, focused on semiconductor materials integration and precursor development. Early in her career, she was a process engineer at Texas Instruments in BEOL cleans processes including wet cleans, dielectrics, and BEOL integration. She has a Ph.D. in Analytical Chemistry from Washington State University.

Dr. Lauren Link manages the Substrate Materials Group within Intel’s Global Supply Chain – Assembly, Test, Sourcing organization. Her group is responsible for designing next generation supply chain solutions to meet Intel’s technology roadmap, enabling new materials and new suppliers. Lauren joined Intel in 2015 as a packaging materials engineer in research and development and moved to supply chain management in 2019. Lauren received her Ph.D. in Materials Science and Engineering with focus in Polymer Engineering from Texas A&M University. She currently lives in Phoenix, AZ.

Dr Lihong Cao is a Director in ASE Group responsible for advanced packaging technology development (2.5D/3D, FOWLP, FOCoS, PoP, SIP), technology promotion, new product introduction, strategic planning, and business engagement. She had led the engineering operation on the advanced SIP and SIM (system in module) product qualification and production.Her expertise and experience span from design, process development and production enablement especially in HPC (High Performance Computing) and AI/ML (Artificial Intelligence & Machine Learning). Prior to joining ASE, as a Sr. Manager in AMD, she led advanced packaging technology qualification and global failure analysis teams to support product development, production and customer services for AMD 28/16/14/7nm products. She is a member of SEMI, IMAPS and ASM. She also holds more than 50 publications.

Lita Shon-Roy – President/CEO and Founder of TECHCET—has worked throughout the semiconductor supply chain, leading strategy, business development, marketing, and sales for chip designers, equipment OEMs, and material suppliers for over 30 years. Her experience spans from process development of flat panel displays to business development of metal organic precursors. She developed new business opportunities for companies such as RASIRC/Matheson Gases, Air Products & Chemicals, and IPEC/Speedfam, and managed marketing and sales in companies such as Air Products/Schumacher, Brooktree/Rockwell, and Hughes Aircraft. She has authored and co-authored articles and texts on semiconductor processing, materials market trends, and worldwide supply chain issues as related to the world economy, and is considered an expert in electronic materials marketing and business development. She holds an M.B.A. from California State University, Dominguez Hills, an M.S. in Electrical Engineering from the University of Southern California, and a B.S. in Chemical Engineering from UC San Diego.

Professor Mike Czerniak is currently working as an Environmental Solutions Business Development Manager (Marketing & Business) at Edwards. He has completed his PhD in Electrical Engineering at the University of Manchester. His vast experience includes: Lead Author on UN IPCC 2019 GHG Guidelines, Visiting Industrial Professor at University of Bristol, Co-Chair SEMI E167 & 175 Energy-Saving standards, Semiconductor Manufacturing Technology: Philips, Cambridge Instruments, VSW, Vacuum Generators (1982-1995)

Milind Weling is Senior Vice President and Head of Programs and Operations for the Intermolecular Business Field at EMD Performance Materials, where he is responsible for the technical execution of customer programs for the discovery and optimization of new materials and leading-edge devices. Milind is a senior engineering and management professional with extensive experience in advanced memory and logic technology development DFM and design-process interactions, new product introduction, and foundry management. His previously held senior engineering and management roles include DFM products engineering at Cadence Design Systems and high-performance CMOS technology development at Sun Microsystems. Philips Semiconductors and VLSI Technology. Milind holds B. Tech and MS degrees in Electrical Engineering from the Indian Institute of Technology, Bombay, and the University of Hawaii, respectively. He holds 50+ patents and has co-authored over 70 technical papers, primarily focused on semiconductor process technology, reliability, and integration.

Nedal T. Nassar is the Chief of the Materials Flow Analysis Section at the National Minerals Information Center, U.S. Geological Survey. Dr. Nassar is a leading expert in mineral criticality assessments and material flow analyses. Employing a systems perspective, Dr. Nassar and his team examine the global stocks and flows of nonfuel mineral commodities at each stage of their life cycle, analyze trends and examine concerns regarding foreign mineral dependency, and develop supply and demand scenarios to better anticipate potential shortfalls. Dr. Nassar received his Ph.D. from Yale University where he worked on the development and application of a methodology for identifying critical minerals. He has continued that work by developing an early-warning screening for critical minerals with the U.S. National Science and Technology Council. Dr. Nassar was recently awarded the Presidential Early Career Award for Scientists and Engineers (PECASE), the highest honor bestowed by the United States Government to outstanding scientists and engineers who are beginning their independent research careers. His research has been published in several high-profile journals including the Proceedings of the National Academy of Sciences, Science Advances, and Environmental Science & Technology. Previously, Dr. Nassar worked as a consultant and as a process development engineer in the semiconductors and data storage industries where he was the recipient of three trade secrets. Dr. Nassar also holds a bachelor's degree in chemical engineering from the University of Minnesota, an MBA in sustainable global enterprise from Cornell University, as well as two master's degrees from Yale University

Pamela Fischer is a Technical Director at ASM America and is based in Hillsboro, OR. She is responsible for the technical roadmap with key customers as well as materials engagements for next generation processes and devices. In addition, she leads a team of process/hardware/software engineers focused on new product introduction for deposition equipment at key customer sites. Prior to joining ASM, Pamela worked in the Thin Films/Diffusion group of Intel’s Logic Technology Development team. She received her Ph.D. in Physical Chemistry from the University of Oregon.

Phil Hecker joined Texas Instruments in 1988. He began his career as a Thin Film process engineer developing barrier metallization for Au-Al intermetallics. He has worked in more than 6 different manufacturing facilities including starting up TI’s first 300mm wafer fab in Dallas, Texas. His diverse background includes 3-dimensional memory for military satellite applications, research and development in field emission devices for flat panel displays, head of a patent committee that filed over 300 patents in a single year of research, and team lead for TI’s PFC Alternatives (Greenhouse Gas Team).
He has worked in manufacturing as an engineer, Section Manager, and Engineering Branch Manager in 3 wafer fabs and has experience in most front end applications including thin films, diffusion, implant, chemical mechanical polishing, and plasma etch. He is currently the Worldwide Procurement and Logistics Quality Director responsible for supplier quality of over 10,000 suppliers and more than $4B in spend. Phil has a B.Sc. in Engineering Physics from the Colorado School of Mines and his MBA from the University of Texas. He currently resides in Colorado riding out the Covid-19 crisis at the top of a mountain.

Ram Trichur is the global head of semiconductor packaging market segment at Henkel. He is responsible for the key strategic and financial objectives for this segment. He has around 20 years of experience in the microelectronics industry covering both the front-end manufacturing and backend assembly processes. He has 3 patents and has published more than 40 publications and articles in leading conferences and industry magazines. He received his master’s degree in Electrical Engineering from University of Cincinnati and completed his executive education in business management from Stanford University’s Graduate School of Business.

Risto Puhakka is President of VLSIresearch, leading the company’s commercial operations and market research activities. He is an expert in Semiconductor Capital Equipment markets as well as Semiconductor Manufacturing. Risto has advised companies, investors, and agencies in the United States, Europe, Japan, Korea, and Taiwan. As an experienced market researcher and analyst, his work draws from VLSI’s global network to provide market intelligence for companies engaged in the semiconductor manufacturing supply chain

Risto advises managers, boards, and investors about semiconductor market trends and strategic industry statistics. He is a regularly invited speaker at conferences about various topics in semiconductor manufacturing and equipment markets. At VLSIresearch, Risto works on numerous client projects in a variety of semiconductor manufacturing segments. Projects include: Advanced Packaging markets and demand , TSMC wafer cost , Failure Analysis Equipment Market analysis , Silicon Demand Outlook , Analog, MEMS, Power Transistor IC manufacturing equipment market , Mask supply analysis and mask manufacturing equipment markets; Global view of the mask supply and demand , IC manufacturing related customer satisfaction survey programs , Due diligence advisories to strategic or private equity investors , Numerous individual equipment market assessments and customer analyses , Financial performance benchmarking for equipment and semiconductor suppliers .

Risto is a graduate of Helsinki University of Technology (MSc) and UC Berkeley, Haas School of Business (MBA). When Risto is not working he cherishes time with his family, runs very long distances, and is occasionally spotted flying model airplanes. ,

Dr. Sanjay Malik has over 20 years of experience working in the semiconductor industry developing materials in advanced lithographic and packaging applications. He holds over 150 patents and has authored over 20 papers.

Satyavolu ‘Pops’ Papa Rao obtained his Bachelor of Technology in Metallurgical Engineering from IIT-Madras, India, and his Ph.D. in Electronic Materials from MIT in 1996. He then joined Texas Instruments, working on process R&D for memory and logic devices. In 2007, he joined IBM Research, at Yorktown Heights, NY, working with teams that developed advanced CMP processes, Si solar cells with all-plated copper front-grid metallization, and nano-structures for DNA nucleotide recognition. In early 2014, Pops joined SEMATECH at Albany, as its Director of Process Technology. He is currently the VP for Research, NY CREATES, based at Albany. His efforts in quantum technologies are focused on the fabrication of high-performance superconducting qubits using 300mm scale advanced processes, single-flux-quantum logic circuits, superconducting optoelectronics for neuromorphic computing, and AlN-based electro-optic integrated circuits.

Scott Jones is a Managing Director in KPMG’s Technology, Media & Telecommunications Strategy practice. He has over 15 years of experience including program management in the semiconductor industry, as an equity analyst covering the semiconductor sector, and serving technology companies as a consultant. Scott has delivered performance improvement services for his clients in areas such as R&D portfolio management, financial modeling of advanced technologies, M&A strategy, postmerger integration, and operating model transformation.

Shaun Miller is the Director of Front-End Materials Procurement in Micron’s Global Procurement organization. He holds a B.S. in Chemical Engineering from the University of Idaho and joined Micron in 1997 as a Wet Process Engineer. Since then he has taken on various roles in CMP Process Engineering, Cost Management, Equipment Maintenance Management, Technology Program Management, and Procurement. His experience includes startup, Technode transfer, and High-Volume Manufacturing of NAND, DRAM, and 3DXP technologies. Now based in Boise, Idaho, Shaun is responsible for Global Materials Category and Supplier Management in Silicon, Bulk Gas, ESG, CMP, Photo and Wet Chemicals, as well as Site Materials Operations in the US, Singapore, Taiwan, and Japan. He likes to spend his free time with his family, camping, hiking, mountain biking, and traveling.

Silke Sorger is a Vice President & Head of Global Procurement Direct Material, Facility Management, and Energy of Infineon Technologies AG, Germany. She has done her Masters in Applied Chemistry and Chemical Engineering from Graz University of Technology, Austria, and completed an MBA from the University of Klagenfurt, Austria.

Steve Eckhardt joined Matheson Tri-Gas in 2013 and has been the Vice President of Global Helium since May 2017, leading Matheson/TNSC’s global helium activities. Previously he was the Director, Helium Sourcing and International Sales and led Matheson’s helium sourcing activities and was responsible for all wholesale bulk helium customers. Steve has 27 years of industrial gases experience and worked for Linde/BOC for 22 years prior to joining Matheson. He held a number of commercial positions including sales, business development, marketing, and key account management. He led Linde’s US business development for LNG and hydrogen fueling, including development of Linde’s California hydrogen fueling initiative from 2009-2013. He holds an engineering degree from Michigan State University and an MBA from the University of Michigan.

S. Iyer is a Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC. More recently, he has been exploring new packaging paradigms and architectures that may enable including in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 70 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow, an APS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS as well as the treasurer of EDS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012.

Terry Francis – Director of Technology & Sr. Analyst of TECHCET— covers metal chemicals and specialty wet cleans. His work experience includes CTO, Sr. Director, Technical application expert, process manager, and engineering management from companies such as Matheson, Air Products, Applied Materials, Burroughs, NCR, AMI, and National Semiconductor. He has over 40 years of experience in the semiconductor industry and has managed businesses from $2M to over $100M in revenues. In addition, he is experienced in material, chemical, and electrical engineering as well as the R&D and development programs in the Chemical/OEM/IDM sectors in the microelectronic industry. He holds an M.B.A. from National University and a B.A. in chemistry from Oregon State University.

Dr. Wenke Weinreich joined Fraunhofer CNT in 2006. The focus of her PhD-studies was on new high-k materials by atomic layer deposition for BWL DRAM technology in cooperation with Qimonda. She received her Ph.D. degree from the Friedrich-Alexander University Erlangen/Nürnberg. Since 2011, she worked as a senior scientist at Fraunhofer IPMS-CNT responsible for 300 mm wafer technology development and physical/electrical characterization of new high-k materials by atomic layer deposition as well as their integration in MIM capacitors for various applications reaching from volatile and non-volatile memories to passive devices with the main focus on 3D structures. Since 2016 she headed the group Energy Devices and was responsible for the development and system integration of integrated energy devices like Si-capacitors, solid-state Li-Ion batteries as well as piezo-, pyro- and thermoelectric energy harvesting and sensor concepts. Now, she is heading the business unit IOT Components & Systems combining the 300 mm activities of Fraunhofer IPMS with regard to low power sensors, power management, nanopatterning and RF CMOS as well as AI processors. Before joining Fraunhofer, she worked as researcher at the Leibniz Institute for Solid State and Materials Research (IFW) in Dresden investigating wet chemical etching processes of polycrystalline silicon for the solar industry. She received her degree in Natural Applied Sciences at the Technical University "Bergakademie" Freiberg in 2005.