Keynote Presentation by Hans Stork, Sr. VP of Technology & CTO of ON Semiconductor

“’Braking’ Through Barriers with Materials”

In addition to panel discussions, presentation sessions will focus on the following:

Agenda Just Updated!

For All Conference Attendees: Please come to the May 10, Wednesday Night Welcome Reception Starting 6pm!

I. Global Issues & Supply-Chain + Lunch

Session Chairs: Dave Roberts of Nantero, Ravi Laxman of Linde

8:15 – 8:45 Welcome by Conference Chairmen – Ed Korczynski & Jonas Sundqvist
  WW Materials Market and Supply Chain Dynamics Overview – Lita Shon-Roy, President / CEO, TECHCET
Keynote:         8:45 to 9:30 ON Semiconductor – Hans Stork, Sr. VP / CTO ‘Braking’ Through Barriers with Materials
9:30 – 10:00 KPMG – Scott Jones, Managing Director, Financial Analyst Global MacroEconomics and Materials Trends
10:00 – 10:30 VLSI Research – Risto Puhakka, President OEM Markets Dynamics and the Semiconductor Industry
10:30 – 10:50 COFFEE BREAK ~ 15 min Coffee Break
10:50 – 11:20 Keller & Heckman – James Votaw, Partner (Washington D.C. Regulations Expert) Regulatory Challenges for Novel Engineered Materials
11:20 – 11:50 Linde – Jack Faught, Head of Isotope Products Rare Gas Status
11:50 – 1:00 LUNCH ~ 1 hour 
II. Immediate Challenges of Materials & Manufacturing + The “Not-so-usual Round Table” Reception

Session Chairs: Mark Raynor of Matheson Gas, Alan Balderson of Kanto Chemical

1:00 – 1:30 Zing Semi. – Richard Chang, Founder and CEO 300mm Wafer Production in China Meeting Demand
1:30 – 2:00 Samsung – Rohit Takalkar, Sr. Materials Engineer Present and Future Challenges of Wafer Specifications
2:00- 2:30 CoorsTek – Richard Hengst, Product Manager Materials & Manufacturing Challenges of CVD SiC
2:30- 3:00 TECHCET / Elcon – Tim Dyer, Sr. Technology Analyst / VP & GM Supply Chain Issues and Changing Market Dynamics for Ceramic Consumables
3:00 – 3:20 COFFEE BREAK ~ 15 min Coffee Break
3:20 – 3:50 Air Liquide, Nathan Stafford, Ph.D., Director Fluorocarbons R&D for Technology and EHS
3:50 – 4:20 Umicore – Oliver Briel, Ph.D., Director Global Business Electronics Creating a Robust and Sustainable Supply Chain for High Volume Cobalt Precursors
4:20- 4:50 Alkane – Alister MacDonald, General Manager – Marketing High K Resources and the Global Supply Chain for Hf/Zr
4:50 – 5:20 Cypress ‐ Tito Tang, Sr. Mfg Engineer. and HighQ ‐ Scott Ray, President / CEO CMP Slurry Recycling & Reuse Challenges and Strategies
5:30 – 8:00pm The “Not-so-usual Round Table” Session (Food and Beverages Served) Microbrew Discussion with Speakers and Materials Trivia
III. Emerging Materials Challenges:  Leading Edge Today + Panel Discussion

Session Chairs – Steve Consiglio of TEL, Jeff Hemphill of Intel, Diane Scott of TECHCET

8:30 – 9:00 IBM – Eric Joseph, Senior Manager and Research Staff Member Materials Process Challenges for Advanced Technology and the Role of Atomic Scale Precision
9:00 – 9:30 TEL – Rob Clark, Sr. Technical Staff Member Welcome to the Atomic Scale: New Paradigms and Processes for Continued Scaling
9:30 – 10:00 Fraunhofer IKTS/TECHCET ‐ Jonas Sundqvist, Ph.D. – Sr. Scientist/Sr. Analyst Dynamic Supply‐Chains for Memory – ALD Precursors
10:00 – 10:20 COFFEE BREAK ~ 15 min Coffee Break
10:20 – 10:50 Brewer Science – Darron Juradja, Semiconductor Business Unit Director DSA Material R&D with Extraordinary Batch Control
10:50 – 11:20 Samsung – Nora Colligan, Principal Materials Engineer Performance Impact of Critical Chemical Quality on Latest Technology Node
11:20 – 11:50 Intel, Jeff Hemphill, Sr. Staff Materials R&D Engineer Metrology Challenges in Controlling Liquids/Slurries
12:00 – 12:25 PANEL DISCUSSION IBM, TEL, Samsung, Intel
12:25 – 12:30 CONCLUSION Wrap Up