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CMC Fabs
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    • 2023 CMC Seminar
      • Overview
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  • TECHCET Reports
    • ALD / CVD Precursors (2)
      • Precursors – ALD/ High K Metals
      • Precursors – Dielectrics
    • CMP Consumables (2)
      • CMP – Slurry, Pads, & Conditioners
      • CMP – Ancillaries: Filters, Rings, Brushes, Conditioners
    • Electronic Gases including Ne & Xe
    • Equipment Components (3)
      • Equipment Components- Quartz
      • Equipment Components – Ceramics / SiC
      • Equipment Components – Silicon
    • Lithography Materials
    • Packaging Materials (8)
      • Bonding Wire
      • Die Attach Materials
      • Encapsulation Materials
      • Leadframe
      • Substrates
      • Underfill Materials
      • Wafer Level Plating Chemicals
      • Wafer Level Package Dielectrics
    • Metal Chemicals for FE & Advanced Packaging
    • Rare Earth
    • Silicon Carbide Wafers
    • Silicon Wafers
    • Sputter Targets
    • Wet Chemicals & Specialty Cleans
    • Executive Editions
      • 2023 Semiconductor Industry Trends & Drivers
      • Market Briefs – Precursor Bulk Delivery Systems (Single User License)
      • Market Briefs – Precursor Development
    • Special Reports
      • Impact of Chip Expansion on US Chemical Supply-Chain
      • Impact on the Wet Chemicals Supply-chain from European Chip Expansions
      • Free Download: Briefing on Impact of US Chip Expansion on Chemical Supply-Chains
  • TECHCET News
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    •         - ALD / CVD Precursors (2)
      •                 - Precursors – ALD/ High K Metals
      •                 - Precursors – Dielectrics
    •         - CMP Consumables (2)
      •                 - CMP – Slurry, Pads, & Conditioners
      •                 - CMP – Ancillaries: Filters, Rings, Brushes, Conditioners
    •         - Electronic Gases including Ne & Xe
    •         - Equipment Components (3)
      •                 - Equipment Components- Quartz
      •                 - Equipment Components – Ceramics / SiC
      •                 - Equipment Components – Silicon
    •         - Lithography Materials
    •         - Packaging Materials (8)
      •                 - Bonding Wire
      •                 - Die Attach Materials
      •                 - Encapsulation Materials
      •                 - Leadframe
      •                 - Substrates
      •                 - Underfill Materials
      •                 - Wafer Level Plating Chemicals
      •                 - Wafer Level Package Dielectrics
    •         - Metal Chemicals for FE & Advanced Packaging
    •         - Rare Earth
    •         - Silicon Carbide Wafers
    •         - Silicon Wafers
    •         - Sputter Targets
    •         - Wet Chemicals & Specialty Cleans
    •         - Executive Editions
      •                 - 2023 Semiconductor Industry Trends & Drivers
      •                 - Market Briefs – Precursor Bulk Delivery Systems (Single User License)
      •                 - Market Briefs – Precursor Development
    •         - Special Reports
      •                 - Impact of Chip Expansion on US Chemical Supply-Chain
      •                 - Impact on the Wet Chemicals Supply-chain from European Chip Expansions
      •                 - Free Download: Briefing on Impact of US Chip Expansion on Chemical Supply-Chains
  • TECHCET News
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      •                 - 2023- TECHCET News
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      •                 - 2019 – TECHCET News
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Past CMC Private Events

Information on past CMC private events can be viewed here.

CMC F2F and Joint Session Meetings Spring 2023 – Round Rock, Texas

CMC F2F and Joint Session Meetings Fall 2022 – Munich, Germany

CMC V2V Meeting Fall 2021- Virtual

CMC Joint Session Meeting Fall 2021- Virtual

CMC F2F Meeting Fall 2020- Virtual

CMC F2F and Joint Session Meeting Spring 2020- Virtual

CMC F2F Meeting Fall 2019- Taoyuan, Taiwan

CMC F2F Meeting Spring 2019- Malta, NY

CMC F2F Meeting Fall 2018- Ningbo, China

CMC F2F Meeting Spring 2018- Phoenix, AZ

CMC F2F Meeting Fall 2017- Hsinchu, Taiwan

CMC F2F Meeting Spring 2017- Dallas, TX

CMC F2F Meeting Fall 2016- Shanghai, China

CMC F2F Meeting Fall 2016- Hillsboro, Oregon

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Nov 9
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CMC Fabs Only Monthly Meeting – Equipment Components

Nov 15
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November Advisory Alert Webinar Session 1

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