“Are Critical Materials for Chip Expansions Ready for Launch?“
Keynote: Jon Taylor, Corporate VP, Fab Engineering at Samsung Austin Semiconductor
Embassy Suites, in Austin/Round Rock, TX April 18-20, 2023
CMC Conference Agenda*All times are in local Austin CT time* |
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| Day 0 | April 18th, 2023 | |
| 4pm – 8pm | Conference Registration & Check-In | |
| 6pm – 8pm | Welcome Reception | |
| Day 1 | April 19th, 2023 | |
| 7-8am | Continental Breakfast | |
| 8am | Welcome by Karey Holland, Alan Balderson, and Jonas Sundqvist | |
| 8:15am | Keynote Speech: Jon Taylor, Corporate VP, Fab Engineering and Public Affairs at Samsung Austin Semiconductor – “Addressing Quality & SCM Challenges for Advanced Chip Manufacturing in the US” |
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| 8:55am | Session I: Global Issues & Trends Impacting Materials Session Chairs: Jeff Hemphill, Fab Materials Organization at Intel, Steve Meeks, Chemical/Gas/CMP Procurement Manager at Texas Instruments, and Tim Drennon, Dir. of Procurement at Samsung Austin Semiconductor |
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| Speaker | Topic | |
| 9:00am | Session Keynote: Corinna Singer, Senior Dir. of Procurement at Infineon | Globalization vs. Regionalization – How to Create Resilience in the Supply Chain |
| 9:30am | Taylor St. Germain, Forecasting Analyst, at TechInsights | The Road to $1 Trillion Through Peaks and Valleys |
| 10:00am | Lita Shon-Roy, MS/MBA, President and CEO at TECHCET | Material Supply-Chains Upsides and Downsides |
| 10:30am | Coffee Break sponsored by Brewer Science | |
| 10:45am | Jeff Perkins, EVP & GM at Yole | Semiconductor Devices for Automotive Applications: What are the Market and Technologies Evolutions Expected? |
| 11:15am | Jim Reed, VP, Key Account Development at Okmetic | Latest Advances in Silicon Wafers Targeted for RF Devices |
| 11:45am | Hosted Lunch sponsored by Applied Materials | |
| 12:55pm | Session II: Heterogenous Integration & Advanced Packaging Materials Session Chairs: Jim Hannah, SEH America Technical Services Engineering, and Dan Tracy, PhD, Sr. Director at TECHCET |
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| Speaker | Topic | |
| 1:00pm | Session Keynote: Dilan Seneviratne, PhD, Dir. of Substrate Packaging Materials at Intel | Substrate Opportunities and Challenges in the Heterogenous Integration |
| 1:25pm | Dan Tracy, PhD, Sr. Director at TECHCET | Advanced Packaging Materials Changing Market & Drivers |
| 1:50pm | Rose Guino, PhD, Principal Applications Engineer at Henkel | Advanced Semiconductor Underfills |
| 2:15pm | Shelby Nelson, Chief Technology Officer at Mosaic Microsystems | Thin Glass for Advanced Packaging Applications |
| 2:40pm | Jaim Nulman, PhD, Chief Product Officer and President at Atlant 3D | Direct Atomic Layer Processing for Backend |
| 3:05pm | Coffee Break sponsored by Edwards Vacuum | |
| 3:20pm | Session III: Immediate Challenges of Materials and Manufacturing Session Chairs: Rachel Ren, Semi OEM Account Director at Edwards, and Bastiaan Saris, Procurement Director at NXP |
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| Speaker | Topic | |
| 3:25pm | Joyce Witowski, Sr. Director, Sustainable Manufacturing at NXP | Challenges and Key Priorities for the Automotive Semiconductor Value Chain |
| 3:50pm | Mousumi Bhat, PhD, VP, Sustainability Programs at SEMI | Sustainable Semiconductor Manufacturing – Processes and Materials |
| 4:15pm | Tim Yeakley, EHS Policy Manager at Texas Instruments, and Laurie Beu, Principal Consultant at Beu Consulting | Semiconductor PFAS Consortium Results and Opportunities |
| 4:40pm | Jeffrey Yoder, PhD, Sr. Dir. HVM Product Management at Air Liquide | Unmasking the Challenges of Diborane Manufacturing and Supply |
| 5:05pm | Robert W. Ivester, PhD, Sr. Advisor for Semiconductor Engagement at NIST | Overview of CHIPS Production and Research Opportunities |
| 5:30pm | SIGNATURE EVENT: “Not So Usual Round Table” Networking Meet the Speakers and get Answers to Questions including CMC Hot Topics. Each Table will be Facilitated by a TECHCET Analyst or Session Chair and include Beer Tasting and Stimulating Trivia. |
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| Day 2 | April 20th, 2023 | |
| 7-8am | Continental Breakfast | |
| 8am | Welcome Back by Karey Holland, Alan Balderson, and Jonas Sundqvist | |
| 8:10am | Session IV: Challenges of Equipment & Component Materials Session Chairs: David Lee, VP Commercial Semiconductor at Coorstek, and Dalia Vernikovsky, CEO at ASNA |
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| Speaker | Topic | |
| 8:15am | Session Keynote: Regina Freed, VP, Alx Solutions at AMAT | Accelerating Materials Engineering |
| 8:45am | Julie Bannister, Sr. Manager, Strategic Marketing at TEL | Ecosystem Readiness for Scaling and Lithography at 3nm and Below |
| 9:10am | Bryan Hendrix, PhD, Fellow at Entegris | Solid Source Vaporization and Processes Enabled |
| 9:35am | Lassi Leppilahti, Application Manager at Beneq | ALD Protective Coatings for Critical Process Equipment Components |
| 10:00am | Coffee Break sponsored by Linde | |
| 10:15am | Zach Dunbar, PhD, Technology Manager at Edwards Vacuum | Hydrogen Recovery |
| 10:40am | Madison Smith, Principal at Cozen | US-China Policy: Chip Restrictions and Future Outlooks |
| 11:05am | Chris Han-Adebekun, PhD, VP of Business Development at Athinia | Integrated Data Collaboration for Value Chain Ecosystem |
| 11:30am | SPECIAL SESSION: PANEL ON UNIVERSAL CHALLENGES TO GROWTH – DATA-FICATION, Hosted by David Thompson, Sr. Managing Director, Applied Materials, and Mike McSwiney, PhD, Chemist Director, Applied Materials. Contributing speakers: Benjamin Jurcik, CTO Electronics Business Line at Air Liquide, Chris Han-Adebekun, PhD, VP of Business Development at Athinia, Regina Freed, VP, Alx Solutions at AMAT, and more coming soon. |
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| 12:30pm | Hosted Lunch | |
| 1:30pm | Session V: Emerging Materials in R&D and Pilot Fabrication Session Chairs: Nicolas Blasco, Emerging Markets Director at Air Liquide, and Steve Consiglio, PhD, Principal Process Engineer at TEL |
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| Speaker | Topic | |
| 1:35pm | Session Keynote: Carolyn Duran, PhD, VP and Engineering Manager, Components Research at Intel | Materials at the Heart of Semiconductor Innovation |
| 2:00pm | Benjamin Eynon, Sr. Dir., Advanced Technology Division at LAM Research | Dry Resist Materials, Equipment, and Process for Improving EUVL Capability and Extending Its Use Well Below the 1nm Node |
| 2:25pm | Joyce Lowes, Dir. of Emerging Materials Technology at Brewer Science | New Developments in Underlayers and Their Role in Advancing EUV Lithography |
| 2:50pm | Glen Scheid, Sr. Manager, Operations, Mask Technology Center at Micron | Photomask Materials – Challenges and Future Requirements |
| 3:15pm | Break | |
| 3:30pm | Satyavolu Papa Rao. PhD, VP, Research at NY CREATES | Materials for Quantum |
| 3:55pm | Steven Eulig, Head of Business Dev, Ops Digital Solutions at EMD Electronics |
Model-based optimization of the application performance
in late-stage material development
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| 4:20pm | Karey Holland, PhD, Chief Strategist at TECHCET | Materials & Technology Roadmap – Where have we been? And where are we going? |