“Are Critical Materials for Chip Expansions Ready for Launch?“
Keynote: Jon Taylor, Corporate VP, Fab Engineering at Samsung Austin Semiconductor
Embassy Suites, in Austin/Round Rock, TX April 18-20, 2023
CMC Conference Agenda*All times are in local Austin CT time* |
||
| Day 0 | April 18th, 2023 | |
| 3pm – 6pm | Conference Registration & Check-In | |
| 6pm – 8pm | Welcome Reception | |
| Day 1 | April 19th, 2023 | |
| 7-8am | Continental Breakfast | |
| 8-8:45am | Keynote Speech: Jon Taylor, Corporate VP, Fab Engineering at Samsung Austin Semiconductor | |
| 8:45am | Session I: Global Issues & Trends Impacting Materials | |
| Speaker | Topic | |
| Session Keynote: Corinna Singer, Director of Procurement at Infineon | Globalization vs. Regionalization – Impact of Geopolitical Tensions and Lessons Learned | |
| Risto Puhakka, Key Accounts at TechInsights, and Taylor St. Germain, Forecasting Analyst at TechInsights | The Road to $1 Trillion Through Peaks and Valleys | |
| J.C. Eloy, President and CEO at Yole | Automotive Chips and Growth Expectations for the Coming Years | |
| Lita Shon-Roy, President and CEO at TECHCET | Material Supply-Chains Upsides and Downsides | |
| Jim Reed, Vice President, Key Account Development at Okmetic | New RF Applications | |
| New Speakers Coming – check back weekly! | ||
| 11:45am | Hosted Lunch | |
| 2:30pm | Session II: Heterogenous Integration & Advanced Packaging Materials |
|
| Session Keynote: Speaker TBD, Intel | TBD | |
| Jan Vardaman, President at TechSearch International and Dan Tracy, Senior Analyst at TECHCET | Advanced Packaging Materials Changing Market & Drivers | |
| Rose Guino, Principal Applications Engineer, Henkel | Advanced Semiconductor Underfills | |
| New Speakers Coming – check back weekly! | ||
| 5:30pm | SIGNATURE EVENT: “Not So Usual Round Table” Networking Meet the Speakers and get Answers to Questions including CMC Hot Topics. Each Table will be Facilitated by a TECHCET Analyst or Session Chair and include Beer Tasting and Stimulating Trivia. |
|
| Day 2 | April 20th, 2023 | |
| 7-8am | Continental Breakfast | |
| 8:00am | Session III: Immediate Challenges of Materials and Manufacturing |
|
| Speaker | Topic | |
| Dhiman Bhattacharyya, Ph.D., Senior Member of Technical Staff at Global Foundries | What’s Next for Specialty Cleaning Materials and Processes | |
| Shivan Ahamparam, Ph.D., Director of Advanced Semiconductor Materials at Air Liquide | The Criticality of Diborane Supply and Applications | |
| New Speakers Coming – check back weekly! | ||
| 11:15am | Session IV: Challenges of Equipment & Component Materials |
|
| Session Keynote: Regina Freed, VP, Alx Solutions at AMAT | Accelerating Materials Engineering | |
| Madison Smith, Principal at Cozen | US-China Policy: Chip Restrictions and Future Outlooks | |
| Speaker TBD, Entegris | Solid Source Vaporization Developments for Advanced Processes | |
| New Speakers Coming – check back weekly! | ||
| 12-2:45pm | Session V: Poster Session |
|
| 2:45pm | Session VI: Emerging Materials in R&D and Pilot Fabrication |
|
| Carolyn Duran, VP and Engineering Manager, Components Research at Intel | The Future of Materials for Leading Edge Devices | |
| Venkat Pallem, Deputy CTO & Technology Director, Thin Film Processing at Air Liquide | Precursors and Process for Selective Deposition and Etching | |
| Julie Bannister, Sr. Manager, Strategic Marketing at TEL | Tool Readiness for Sub 5nm Technology | |
| Papa Rau “Pops” from CNSE | Materials for Quantum | |
| New Speakers Coming – check back weekly! | ||