“Are Critical Materials for Chip Expansions Ready for Launch?“
Keynote: Jon Taylor, Corporate VP, Fab Engineering at Samsung Austin Semiconductor
Embassy Suites, in Austin/Round Rock, TX April 18-20, 2023
CMC Conference Agenda*All times are in local Austin CT time* |
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Day 0 | April 18th, 2023 | |
3pm – 6pm | Conference Registration & Check-In | |
6pm – 8pm | Welcome Reception | |
Day 1 | April 19th, 2023 | |
7-8am | Continental Breakfast | |
8-8:45am | Keynote Speech: Jon Taylor, Corporate VP, Fab Engineering at Samsung Austin Semiconductor | |
8:45am | Session I: Global Issues & Trends Impacting Materials | |
Speaker | Topic | |
Session Keynote: Corinna Singer, Director of Procurement at Infineon | Globalization vs. Regionalization – Impact of Geopolitical Tensions and Lessons Learned | |
Risto Puhakka, Key Accounts at TechInsights, and Taylor St. Germain, Forecasting Analyst at TechInsights | The Road to $1 Trillion Through Peaks and Valleys | |
J.C. Eloy, President and CEO at Yole | Automotive Chips and Growth Expectations for the Coming Years | |
Lita Shon-Roy, President and CEO at TECHCET | Material Supply-Chains Upsides and Downsides | |
Jim Reed, Vice President, Key Account Development at Okmetic | New RF Applications | |
New Speakers Coming – check back weekly! | ||
11:45am | Hosted Lunch | |
2:30pm | Session II: Heterogenous Integration & Advanced Packaging Materials |
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Session Keynote: Speaker TBD, Intel | TBD | |
Jan Vardaman, President at TechSearch International and Dan Tracy, Senior Analyst at TECHCET | Advanced Packaging Materials Changing Market & Drivers | |
Rose Guino, Principal Applications Engineer, Henkel | Advanced Semiconductor Underfills | |
New Speakers Coming – check back weekly! | ||
5:30pm | SIGNATURE EVENT: “Not So Usual Round Table” Networking Meet the Speakers and get Answers to Questions including CMC Hot Topics. Each Table will be Facilitated by a TECHCET Analyst or Session Chair and include Beer Tasting and Stimulating Trivia. |
Day 2 | April 20th, 2023 | |
7-8am | Continental Breakfast | |
8:00am | Session III: Immediate Challenges of Materials and Manufacturing |
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Speaker | Topic | |
Dhiman Bhattacharyya, Ph.D., Senior Member of Technical Staff at Global Foundries | What’s Next for Specialty Cleaning Materials and Processes | |
Shivan Ahamparam, Ph.D., Director of Advanced Semiconductor Materials at Air Liquide | The Criticality of Diborane Supply and Applications | |
New Speakers Coming – check back weekly! | ||
11:15am | Session IV: Challenges of Equipment & Component Materials |
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Session Keynote: Regina Freed, VP, Alx Solutions at AMAT | Accelerating Materials Engineering | |
Madison Smith, Principal at Cozen | US-China Policy: Chip Restrictions and Future Outlooks | |
Speaker TBD, Entegris | Solid Source Vaporization Developments for Advanced Processes | |
New Speakers Coming – check back weekly! | ||
12-2:45pm | Session V: Poster Session |
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2:45pm | Session VI: Emerging Materials in R&D and Pilot Fabrication |
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Carolyn Duran, VP and Engineering Manager, Components Research at Intel | The Future of Materials for Leading Edge Devices | |
Venkat Pallem, Deputy CTO & Technology Director, Thin Film Processing at Air Liquide | Precursors and Process for Selective Deposition and Etching | |
Julie Bannister, Sr. Manager, Strategic Marketing at TEL | Tool Readiness for Sub 5nm Technology | |
Papa Rau “Pops” from CNSE | Materials for Quantum | |
New Speakers Coming – check back weekly! |