CMC 2023 Conference Agenda


 “Are Critical Materials for Chip Expansions Ready for Launch?

Keynote: Jon Taylor, Corporate VP, Fab Engineering at Samsung Austin Semiconductor

Embassy Suites, in Austin/Round Rock, TX April 18-20, 2023
CMC Conference Agenda
*All times are in local Austin CT time*
Day 0 April 18th, 2023
3pm – 6pm Conference Registration & Check-In
6pm – 8pm Welcome Reception
Day 1 April 19th, 2023
7-8am Continental Breakfast
8am Welcome by Karey Holland, Alan Balderson, and Jonas Sundqvist
8:15am Keynote Speech: Jon Taylor, Corporate VP, Fab Engineering and Public Affairs at Samsung Austin Semiconductor –
“Addressing Quality & SCM Challenges for Advanced Chip Manufacturing in the US”
8:55am Session I: Global Issues & Trends Impacting Materials
Session Chairs: Jeff Hemphill
, Fab Materials Organization at Intel, Steve Meeks, Chemical/Gas/CMP Procurement Manager at Texas Instruments, and Tim Drennon, Dir. of Procurement at Samsung Austin Semiconductor
Speaker Topic
9:00am Session Keynote: Corinna Singer, Senior Dir. of Procurement at Infineon Globalization vs. Regionalization – Impact of Geopolitical Tensions and Lessons Learned
9:30am Risto Puhakka, Key Accounts, and Taylor St. Germain, Forecasting Analyst, at TechInsights The Road to $1 Trillion Through Peaks and Valleys
10:00am Lita Shon-Roy, MS/MBA, President and CEO at TECHCET Material Supply-Chains Upsides and Downsides
10:30am Break
10:45am Jeff Perkins, EVP & GM at Yole Semiconductor Devices for Automotive Applications: What are the Market and Technologies Evolutions Expected?
11:15am Jim Reed, VP, Key Account Development at Okmetic Latest Advances in Silicon Wafers Targeted for RF Devices
11:45am Hosted Lunch
12:55pm Session II: Heterogenous Integration & Advanced Packaging Materials
Session Chairs: Jim Hannah,
SEH America Technical Services Engineering, and Dan Tracy, PhD, Sr. Director at TECHCET
Speaker Topic
1:00pm Session Keynote: Dilan Seneviratne, PhD, Dir. of Substrate Packaging Materials at Intel Substrate Opportunities and Challenges in the Heterogenous Integration
1:25pm Jan Vardaman, President at TechSearch International and Dan Tracy, PhD, Sr. Director at TECHCET Advanced Packaging Materials Changing Market & Drivers
1:50pm Rose Guino, Principal Applications Engineer at Henkel Advanced Semiconductor Underfills
2:15pm Shelby Nelson, Chief Technology Officer at Mosaic Microsystems Thin Glass for Advanced Packaging Applications
2:40pm Jaim Nulman PhD, Chief Product Officer and President at Atlant 3D Direct Atomic Layer Processing for Backend
3:05pm Break
3:20pm Session III: Immediate Challenges of Materials and Manufacturing
Session Chairs: Rachel Ren,
Semi OEM Account Director at Edwards, and Bastiaan Saris, Procurement Director at NXP
Speaker Topic
3:25pm Grant McEwan, VP, FE Manufacturing Ops, Strategy and Sustainable Manufacturing at NXP Automotive Requirements and Limitations for FE Material Suppliers
3:50pm Mousumi Bhat, PhD, VP, Sustainability Programs at SEMI Sustainable Semiconductor Manufacturing – Processes and Materials
4:15pm Tim Yeakley, EHS Policy Manager at Texas Instruments, and Laurie Beu, Principal Consultant at Beu Consulting PFAS/Sustainability
4:40pm Jeffrey Yoder, Sr. Dir. HVM Product Management at Air Liquide Unmasking the Challenges of Diborane Manufacturing and Supply
5:05pm Robert W. Ivester, PhD, Sr. Advisor for Semiconductor Engagement at NIST US CHIPS Act Progress
5:30pm SIGNATURE EVENT: “Not So Usual Round Table” Networking 
Meet the Speakers and get Answers to Questions including CMC Hot Topics. Each Table will be Facilitated by a TECHCET Analyst or Session Chair and include Beer Tasting and Stimulating Trivia.
Day 2 April 20th, 2023 
7-8am Continental Breakfast
8am Welcome Back by Karey Holland, Alan Balderson, and Jonas Sundqvist
8:10am Session IV: Challenges of Equipment & Component Materials
Session Chairs: David Lee,
VP Commercial Semiconductor at Coorstek, and Dalia Vernikovsky, CEO at ASNA
Speaker Topic
8:15am Session Keynote: Regina Freed, VP, Alx Solutions at AMAT Accelerating Materials Engineering
8:45am Zach Dunbar, PhD, Technology Manager at Edwards Vacuum Hydrogen Recovery
9:15am Julie Bannister, Sr. Manager, Strategic Marketing at TEL Ecosystem Readiness for Scaling and Lithography at 3nm and Below
9:45am Scott Battle, Entegris Solid Source Vaporization Developments for Advanced Processes
10:15am Break
10:30am Madison Smith, Principal at Cozen US-China Policy: Chip Restrictions and Future Outlooks
11:00am Chris Han-Adebekun, PhD, VP of Business Development at Athinia Integrated Data Collaboration for Value Chain Ecosystem
11:30am SPECIAL SESSION: PANEL ON UNIVERSAL CHALLENGES TO GROWTH – DATA-FICATION, Hosted by David Thompson, Sr. Managing Director, Applied Materials. Contributing speakers: Benjamin Jurcik, CTO Electronics Business Line at Air Liquide, Chris Han-Adebekun, PhD, VP of Business Development at Athinia, Regina Freed, VP, Alx Solutions at AMAT, and more coming soon.
12:30pm Hosted Lunch
1:30pm Session VI: Emerging Materials in R&D and Pilot Fabrication
Session Chairs: Nicolas Blasco,
Emerging Markets Director at Air Liquide, and Steve Consiglio, PhD, Principal Process Engineer at TEL
Speaker Topic
1:35pm Session Keynote: Carolyn Duran, PhD, VP and Engineering Manager, Components Research at Intel Materials at the Heart of Semiconductor Innovation
2:00pm Benjamin Eynon, Sr. Dir., Advanced Technology Division at LAM Research Dry Resist Materials, Equipment, and Process for Improving EUVL Capability and Extending Its Use Well Below the 1nm Node
2:25pm Joyce Lowes, Dir. of Emerging Materials Technology at Brewer Science New Developments in Underlayers and Their Role in Advancing EUV Lithography
2:50pm Glen Scheid, Sr. Manager, Operations, Mask Technology Center at Micron CVP, Mask, and Materials Characterization
3:15pm Break
3:30pm Satyavolu Papa Rao. PhD, VP, Research at NY CREATES Materials for Quantum
3:55pm Steven Eulig, Head of Business Dev, Ops Digital Solutions at EMD Electronics
Model-based optimization of the application performance
in late-stage material development
4:20pm Karey Holland, Chief Technology Officer at TECHCET Materials & Technology Roadmap – Where have we been? And where are we going?

Copies of the slides and recordings of presentations will be made available within a week of the Conference completion