2024 CMC Conference Agenda

2024 CMC Conference Agenda
Conference Chairs:
Karey Holland,
Chief Strategist – TECHCET and
Alan Balderson,
Product Manager – Kanto
Day 0 – April 9th, 2024
Conference Check-In
Welcome Reception at 6PM
Day 1 – April 10th, 2024
Welcome and Opening Remarks
Keynote Speech: Pavel Freundlich, Ph.D.,
CTO & VP, Power Solutions Group – onsemi
“Revolutionizing Power Semiconductors: The Rise of Wide Bandgap Materials”
 9:00 – Session I: Global Issues & Trends Impacting Materials
Session Chairs: Steve Meeks
– Texas Instruments and Jeff Hemphill – Intel
Speaker Topic
Scott Jones, Managing Director, STS Practice Lead – Alvarez & Marsal Economic Trends Impacts on the Semiconductor Industry
Lita Shon-Roy, President and CEO – TECHCET Semiconductor Material Supply Chain Updates
Dan Alvarez, Ph.D., Founder and CEO – Purity ReSource Improving the Environmental Impact of Semiconductor Materials
Coffee Break
Jeff Perkins, Executive Vice President and General Manager – Yole  More Than Moore Megatrends Beyond Silicon
Rob Rhoades, Ph.D, Co-Founder, President, & CEO – X-Trinsic SiC Wafering Processes from 150 to 200mm: An Evolution
Tyler Scott, Sr. Manager Global Sourcing – onsemi Best Practices on Management Materials Across Borders – Local vs. Global Supply Chain
Lunch
1:20 – Session II: Heterogenous Integration & Advanced Packaging Materials
Session Chairs: Jim Hannah – 
SEH America and Paul Werbaneth – SEMI ASMC
Session Keynote: Dilan Seneviratne, Ph.D, Principal Engineer – Intel Glass for Advanced Packaging Substrates
Jun-Ro Yoon, Ph.D, TGV Program Manager – Corning Glass for Advanced Packaging
Coffee Break
Jeb Flemming, Founder and CTO – 3D Glass Solutions Glass Devices for Next Generation Packaging and Rf Signal Conditioning
Lihong Cao, Sr. Director, Engineering/Technical Marketing – ASE Group Materials Needed for Advanced Packaging
“Not-So-Usual” Roundtable Networking Event
with Beer Tasting and Trivia! – Come meet Speakers and Discuss Hot Topics!
Day 2 – April 11th, 2024
Day 2 Keynote: David Thompson, Ph.D., VP, Process Engineering, Components Research – Intel
“The Future of Materials for Leading Edge Devices”
8:40 – Session III: Immediate Challenges of Materials and Manufacturing
Session Chairs: Rachel Ren
– Edwards and Elena Valdez – NXP
Adam Schafer, Ph.D, Head of Supply Chain Strategy – US CHIPS Program Office CHIPS Program Overview for the Semiconductor Manufacturing Supply Chain
Pawitter Mangat, Ph.D, Sr. Director, Global Supplier Quality & Material Engineering – GlobalFoundries Materials & HV Manufacturing in the AI Era – Foundry Perspective
Dawn Graunke, Supply Chain Sustainability Regulatory Manager – Intel PFAS Concerns on the Semiconductor Industry
Coffee Break
Adam Paul, Sr. Director, WW Procurement – Analog Devices  Needing More for Less – IDM Asks & Concerns for Material Suppliers
Jeffrey Yoder, Ph.D, Sr. Director HVM Product Management – Air Liquide Commercialization of MoO2Cl2 for Advanced Node Applications
11:05 – Session IV: Challenges of Equipment & Consumable Component Materials
Session Chairs: David Lee
– Coorstek and Dalia Vernikovsky – ASNA
Session Keynote: George Alajajian, Ph.D, VP, Strategic Parts Supply Chain – Intel Fab Equipment Component Supply Chain – Evolution Continues
Alexander Kaiser, Global Product Manager, CTI, Polycold and iTrap – Edwards Process Control Challenges and Approaches for Next Generation Semiconductor Devices and Materials
Lunch
Trace Hurd, Ph.D, Sr. Director, Technology Development – Tokyo Electron Sustainable Materials Strategies For Semiconductor Manufacturing
James Hamzik, Sr. Manager, Membrane R&D – Entegris Challenges in the Purification of Acids and Bases to Achieve Sub-ppt Cleanliness Levels
Bhavya Vaidya, VP Supply Chain – LAM Research Supply Chain Sourcing Flexibility
Coffee Break
2:30 – Session V: Emerging Materials in R&D and Pilot Fabrication
Session Chairs: Steve Consiglio
– TEL and Nicolas Blasco – Air Liquide
Eric Joseph, Ph.D., Senior Manager, Master Inventor, and Principal Research Staff Member, Advanced Materials and Process – IBM Plasma Processing and the Semiconductor Supply Chain in an Era of Low GWP
and/or PFAS-Free Gas Chemistries
Satyavolu Papa Rao, Ph.D, VP for Research – NY CREATES Materials Challenges for Quantum Computing
Stefan Müller, Ph.D, CTO – Ferroelectric Memory Company Ferroelectric Hafnium Oxide for Memory Cells: Manufacturing Aspects
Karl Robinson, Ph.D, Sr. Manager Key Account Technology – ASM GAA to CFET – PEALD Challenges
Karey Holland, Ph.D, Chief Strategist – TECHCET ALD/CVD