2024 CMC Conference Agenda

2024 CMC Conference Agenda
Conference Chairs:
Karey Holland, Chief Strategist – TECHCET and
Alan Balderson, Product Manager – Kanto
Day 0 – April 9th, 2024
3:00 PM Conference Check-In
Location: Crowne Plaza Resort Lobby
6:00 PM Welcome Reception at 6PM
Location: Crowne Plaza Resort Fountain Courtyard
Day 1 – April 10th, 2024
7:15 AM Breakfast sponsored by NY CREATES
Location: Crowne Plaza Resort Pergola Patio
8:00 AM Welcome and Opening Remarks
Karey Holland, TECHCET and Alan Balderson, Kanto
Kevin Hartke, Mayor of Chandler, AZ
8:15 AM Keynote Speech: Pavel Freundlich, Ph.D.,
CTO & VP, Power Solutions Group – onsemi
“Revolutionizing Power Semiconductors:
The Rise of Wide Bandgap Materials”
9:00 AM Session I: Global Issues & Trends Impacting Materials
Session Chairs: Jeff Hemphill – Intel and Jeff Loewecke – Texas Instruments
Location: Crowne Plaza Resort San Marcos Ballroom
Time Speaker Topic
9:05 AM Scott Jones, Managing Director – Alvarez & Marsal Semiconductor Industry and M&A Outlook
9:35 AM Jeff Perkins, Executive Vice President and General Manager – Yole  More Than Moore Megatrends Beyond Silicon
10:05 AM Lita Shon-Roy, President and CEO – TECHCET Navigating the Semiconductor Landscape: Enhancing Resilience Across Materials Supply Chains
10:35 AM Coffee Break sponsored by Edwards
10:50 AM Tyler Scott, Sr. Manager Global Sourcing – onsemi Best Practices on Management Materials Across Borders – How Do You Deal with Different Fabs Located in Different Countries. Local vs. Global Supply Chain
11:20 AM Dan Alvarez, Ph.D., Founder and CEO – Purity ReSource Improving the Environmental Impact of Semiconductor Materials
11:50 AM Rob Rhoades, Ph.D, Co-Founder, President, & CEO – X-Trinsic SiC Wafering Processes from 150 to 200mm: An Evolution
12:20 PM Lunch sponsored by Applied Materials
1:20 PM Session II: Heterogenous Integration & Advanced Packaging Materials
Session Chairs: Jim Hannah – SEH America and Shaun Bowers – TECHCET
Location: Crowne Plaza Resort San Marcos Ballroom
1:25 PM Session Keynote: Dilan Seneviratne, Ph.D, Principal Engineer – Intel Glass Substrates for Advanced Packaging
2:10 PM Lihong Cao, Ph.D, Sr. Director, Engineering/Technical Marketing – ASE Group Material Requirements for Advanced Packaging and Heterogeneous Integration
2:40 PM Coffee Break sponsored by Linde
2:55 PM Jun-Ro Yoon, Ph.D, TGV Program Manager – Corning Materials Supply Perspective: Glass for Advanced Packaging
3:25 PM Jeb Flemming, Founder and CTO – 3D Glass Solutions Glass Devices for Next Generation Packaging and Rf Signal Conditioning
3:55 PM Andy Mackie, Ph.D, Principal Engineer, Advanced Materials – Indium Corporation From SiP to SiC: Advanced Metal Alloys meet Evolving Reliability Challenges
4:25 PM Abdelhamid ElSawy, Ph.D, Sr. Research and Development Scientist – MacDermid Alpha Advancements in Hybrid Bonding: Engineering Grain Boundaries for Enhanced Microelectronic Device Assembly
5:30 PM “Not-So-Usual” Roundtable Networking Event
with Beer Tasting and Trivia! – Come meet Speakers and Discuss Hot Topics!
Location: Crowne Plaza Resort Fountain Courtyard
Day 2 – April 11th, 2024
7:15 AM Breakfast
Location: Crowne Plaza Resort Pergola Patio
8:05 AM Day 2 Keynote: David Thompson, Ph.D., VP, Process Engineering, Components Research – Intel
“The Criticality of Materials Innovation for
the Future of Sustainable Compute”
8:40 AM Session III: Immediate Challenges of Materials and Manufacturing
Session Chairs: Rachel Ren – Edwards and Nathan Cline – NXP
Location: Crowne Plaza Resort San Marcos Ballroom
8:45 AM Adam Schafer, Ph.D, Head of Supply Chain Strategy – US CHIPS Program Office CHIPS Program Overview for the Semiconductor Manufacturing Supply Chain
9:10 AM Dawn Graunke, Supply Chain Sustainability Regulatory Manager – Intel PFAS Concerns on the Semiconductor Industry
9:35 AM Adam Paul, Sr. Director, WW Procurement – Analog Devices  Needing More for Less – IDM Asks & Concerns for Material Suppliers
10:00 AM Coffee Break sponsored by Tosoh
10:15 AM Jeffrey Yoder, Ph.D, Sr. Director HVM Product Management – Air Liquide Commercialization of MoO2Cl2 for Advanced Node Applications
10:40 AM Pawitter Mangat, Ph.D, Sr. Director, Global Supplier Quality & Material Engineering – GlobalFoundries Materials & HV Manufacturing in the AI Era – Foundry Perspective
11:05 AM Session IV: Challenges of Equipment & Consumable Component Materials
Session Chairs: David Lee – Coorstek and Dalia Vernikovsky – ASNA
Location: Crowne Plaza Resort San Marcos Ballroom
11:10 AM Session Keynote: George Alajajian, Ph.D, VP, Strategic Parts Supply Chain – Intel Fab Equipment Component Supply Chain – Evolution Continues
11:35 AM Alexander Kaiser, Global Product Manager – Edwards Vacuum Process Control Challenges and Approaches for Next Generation Semiconductor Devices and Materials
12:00 PM Lunch
1:00 PM Bhavya Vaidya, VP Supply Chain – LAM Research Supply Chain Sourcing Flexibility
1:25 PM Trace Hurd, Ph.D, Sr. Director, Technology Development – Tokyo Electron Sustainable Materials Strategies For Semiconductor Manufacturing
1:50 PM James Hamzik, Sr. Manager, Membrane R&D – Entegris Challenges in the Purification of Acids and Bases to Achieve Sub-ppt Cleanliness Levels
2:15 PM Coffee Break sponsored by TECHCET
2:30 PM Session V: Emerging Materials in R&D and Pilot Fabrication
Session Chairs: Steve Consiglio – TEL and Nicolas Blasco – Air Liquide
Location: Crowne Plaza Resort San Marcos Ballroom
2:35 PM Karl Robinson, Ph.D, Sr. Manager Key Account Technology – ASM GAA to CFET – PEALD Challenges
3:00 PM Eric Joseph, Ph.D., Sr. Manager, Master Inventor, and Principal Research Staff Member, Advanced Materials and Process – IBM Plasma Processing and the Semiconductor Supply Chain in an Era of Low GWP
and/or PFAS-Free Gas Chemistries
3:25 PM Satyavolu Papa Rao, Ph.D, VP for Research – NY CREATES Materials Challenges for Quantum Computing
3:50 PM Stefan Müller, Ph.D, CTO – Ferroelectric Memory Company Ferroelectric Hafnium Oxide for Memory Cells: Manufacturing Aspects
4:15 PM Karey Holland, Ph.D, Chief Strategist – TECHCET Advanced Memory and Logic Technology Roadmaps and Implications to Processes and Materials