2022 CMC Conference Agenda

7th Annual CMC Conference, held at the Crowne Plaza Hotel, in Chandler, Arizona, April 28-29, 2022

CMC Conference Agenda
Day 0	April 27th, 2022
3:30 pm -6:30 pm PT	Conference Registration & Check-In
6:00 pm -7:30 pm PT	Welcome Reception Sponsored by Okmetic
Day 1	April 28th, 2022
7am-8am PT	Breakfast - Sponsored by EMD Electronics
8am PT	Welcome Address: Lita Shon-Roy, TECHCET President/CEO & Karey Holland, PhD, TECHCET, Sr. Advisor, Conference Chairwoman
8:05am PT	Kevin Hartke, Mayor of Chandler Arizona	"Welcome to Chandler, Arizona"
KEYNOTE- 8:15am PT	John Whitman, Corporate Vice President, Operations Central Team & Procurement; Micron Technologies Corporation on "Covid Impacts on our Supply Assurance Playbook"
	Speaker	Topic
9am PT Location: San Marcos Ballroom	Session I: Business Trends & Global Issues, Session Chairs: Jeff Hemphill, Intel, and Mark Raynor, Matheson Gases
9:05am PT	Risto Puhakka, VP, Key Accounts VLSIresearch / TechInsights	"Semiconductor Equipment Markets in Geopolitically Turbulent Environment, Will the Hypergrowth Continue?"
9:30am PT	Mario Morales, Group Vice President, IDC	"Semiconductor Market Outlook: Demand Becomes the Lever that Eases Supply Constraints This Year"
9:55am PT	Lita Shon-Roy, President and CEO of TECHCET	"“The Achilles Heel” to the Rapidly Expanding Chip Industry - Materials"
10:20am PT	Coffee / Networking Break by Edwards
10:35am PT	Jeff Gambino, Staff Engineer, onsemi	"Materials Challenges for More-than-Moore Device"
11am PT	Chris Jones, PhD, Environmental Solutions Business Development Manager, Edwards Vacuum	"Water Supply Challenges – Global Experience Locally Applied"
11:25am PT	Micah Miranda, Director, City of Chandler	"Public and Private partnerships for infrastructure in Chip Manufacturing and investment in the City of Chandler and Water"
11:50am PT	John Currier, Director of US Environment and Sustainability Policy, Global Government Affairs, Intel Corporation	"Addressing Critical Chemicals of High Concern – Intel’s Strategic Plan"
12:15pm (noon) PT	Hosted Lunch - Ascensus Specialties / Strem Located at the Pergola
1:15pm PT Location: San Marcos Ballroom A	Session II: Immediate Challenges of Materials & Manufacturing, Session Chairs: Ruben Pesina, TI, and Alan Balderson, Kanto, [NOTE: this session runs concurrently with Session III]
1:20pm	Pratik Joshi, Executive Technical Advisor, FAB Engineering Quality, Samsung	"Global / Local Needs and Quality Expectations for Materials"
1:45pm	Shari Liss, Executive Director, SEMI Foundation	"The workforce supply-chain and need for workforce development "
2:10pm	Michael Pittroff, Marketing Manager Global Semiconductor Chemicals, Solvay	"Environmental-Friendly Fluorine Mixture for CVD Cleaning Processes to replace C2F6 and NF3 under industrial Conditions"
2:35pm	Stan Smith, PhD, Director Electronics Technology Linde Electronic Gases & Chemicals	"Green H2 for Fabs, Challenges, and Applications"
3pm	Coffee / Networking Break by Coexcell with Raffle Giveaway
3:15pm	Jim Reed, President at Okmetic, and Dan Tracy, PhD, Sr. Director of Market Research at TECHCET	"Wafer Market Update and an Interview on Silicon Suppliers & IDMs Working Together to Optimize Efficiency and Cost"
3:40pm	Dr. Rob Rhoades, Co-Founder President and CTO, X-trinsic	"The world is getting even more SiC"
4:05pm	Karl Urquhart, Director of R&D and Technology DFS	"NH4OH sustainability - onsite generation, Ultra High Purity (UHP) chemical and gas systems for the semiconductor industry."
4:30pm	Matthew Stephens, CEO Impact Nano	"Sustainable computing and semiconductor fabrication: Opportunities and challenges in the materials supply chain"
1:15pm PT Location: San Marcos Ballroom B	Session III: Future Challenges for Equipment & Component Materials, Session Chairs: Jeff Wessel, Tosoh, and David Xu, Momentive Technologies [NOTE: this session runs concurrently with Session II, above]
Session Keynote- 1:20pm	George Alajajian, Ph.D., VP Strategic Parts Supply Chain, Intel Corp.	"Consumable Equipment Components Requirements for Leading Edge IDMs"
1:45pm	Dalia Vernikovsky, CEO & GM at Applied Seals NA, Inc	"Polymeric Sealing Properties, Advances & Limitations"
2:10pm	Jennifer Braggin, Director, CTO’s Office, Entegris	"New filtration and purification technologies for 3nm and beyond for better contamination control and yield improvement"
2:35pm	Sami Sneck, Vice President, Advanced ALD, Beneq	“Enhancing yield with ALD coatings for critical chamber components”
3pm	Coffee / Networking Break - Coexcell with Raffel Giveaway
3:15pm	Nicole Rutherford, Product Manager, Greene Tweed	“Large-Area Batch ALD Coatings for Chamber Component Protection”
3:40pm	Christoph Hemmann, EVP Head of Airfreight Americas Region, DB Schenker	“Current Logistic Challenges & Future Outlook ”
4:05pm	Michael Bristol, Sr. Product Manager, CoorsTek	“Trends in High Temp Furnace Components for Power Device Processing”
4:30pm	TIm Dyer, President of Elcon Precision LLC	"Semiconductor ESC and Ceramic Parts Industry Needs and Technical Challenges"
5:15pm	SIGNATURE EVENT: "Not So Usual Round Table" Networking located at La Ventana Ballroom Meet the Speakers and get Answers to Questions including CMC Hot Topics - Go to the "Fountain Courtyard" Each Table will be Facilitated by a TECHCET Analyst or Conference Session Chair and include Beer Tasting and Stimulating Trivia Moderator: TECHCET Analyst - Diane Scott PhD

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Day 2	April 29th, 2021 - Sessions IV & V Running Concurrently (8am to 12:35pm)
7am-8am PT	Breakfast - Sponsored by EMD Electronics
8:00am PT	Welcome Back: Karey Holland, PhD, & TECHCET Lita Shon-Roy, TECHCET
	Speaker	Topic
8:05am PT Location: San Marcos Ballroom A	Session IV: Emerging Materials & Processes, Session Chairs: Steve Consiglio PhD, TEL and Nicolas Blasco PhD, Air Liquide, [NOTE: this session runs concurrently with Session V]
8:10am	Hemanth Jagannathan, Principal Research Staff Member, IBM Research	"Foresights on CMOS technology scaling to 2nm and Beyond "
8:35am	Subhadeep Kal, TEL, Principal Process Engineer	"Challenges and Opportunities in Fabricating Nanosheet Based Devices."
9am	Nicolas Blasco PhD, Emerging Markets Director, Air Liquide	"Emerging ALD/CVD Precursors Trends and Challenges for Advanced Metallization"
9:25am	Prof. Greg Denbeaux, Associate Professor SUNY Poly	"EUV Lithography and Resist Challenges"
9:50am	David Thompson, Sr. Managing Director, Applied Materials	"Ramping Critical Materials to Meet Disruptive Needs."
10:15	Coffee / Networking Break by Brewer Science
10:30am	Kutup Kurt, Head of Operations of Digital Solutions, EMD Electronics	"Accelerating Digital Twin Development: Machine Learning for Chemical Engineers"
10:55am	Kyusang Lee, FSB	"Remote Epitaxy of GaN Membranes Towards Commercialization"
11:20am	Jong Woung (Jason) Kim, Sr. Dev't & Integration Engineer, ECI	"Metrology for Bulk Chemicals for Advanced Nodes: Main components and Contaminants"
11:45am	Jeff Spiegelmann, CEO, RASIRC	"Hydrogen Peroxide Gas on the road from R&D to HVM for superior HZO films"
8:05am PT Location: San Marcos Ballroom B	Session V: Session: Materials for Advanced Packaging and Heterogeneous Integration, Session Chairs: James Hannah, Shin-Etsu Handotai (SEH), and Dan Tracy, PhD., TECHCET, [NOTE: this session runs concurrently with Session IV, above]
8:10am	Dr. Lihong Cao, Director, Engineering/Technical Marketing, ASE	"Interposers vs Bridges and Other Materials Challenges"
8:35am	Christopher Milasincic , HD Microsystems,	"Advanced Polyimide Challenges, Including Low-K "
9am	Jan Vardaman, President, TechSearch International	Advanced Packaging Trends and The Limits to Growth
9:25am	Keita "JJ" Johno, Field Engineer, Showa Denko	"Taking the next step towards smaller and faster substrates"
9:50am	Jay Zhang, Business Development Director, Corning	"Tailoring Glass Properties for Advanced Packaging"
10:15am	Coffee / Networking Break by Brewer Science
10:30am	Rama Puligadda, Chief Technology Officer, Brewer Science	"Recent advances in permanent and temporary wafer bonding materials"
10:55am	Ram Trichur, Henkel	"Wafer level molding materials for advanced packaging"
11:20am	Yu-Tao Yang, doctoral candidate, UCLA	"Emerging applications using Niobium-based superconducting Silicon interconnect fabric"
11:45am	Maksym Plakhotnuyuk, CEO, Atlant 3D Nanosystems	"ALD Wafer level 3D printing of Metals or for metallization"
	Wrap Up